Notice of Participation in JPCA Show 2012 - Silicon Through-Silicon Via (TSV) for 3D Implementation Package and Material Development Applications & TSV-TEG Chips with Bumps on Both Sides of the Wafer.

Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the "JPCA Show 2012" eX-tech 2012 booth, held at Tokyo Big Sight from June 13 (Wednesday) to June 15 (Friday), 2012.
http://www.jpcashow.com/show2012/
At this exhibition, we will introduce silicon through-silicon vias (TSV) and TSV-TEG chips with bumps on both sides of the wafer, intended for 3D packaging and material development applications.
■ Overview of JPCA Show 2012
[Dates] June 13 (Wednesday) to June 15 (Friday), 2012 - 3 days
[Opening Hours] 10:00 AM to 5:00 PM
[Venue] Tokyo Big Sight (3-21-1 Ariake, Koto-ku, Tokyo)
[Our Booth] 3F-33-19
【Contact Information for This Matter】
Well, Inc.
Test Wafer Sales Department
Tel: 03 (5715) 3501
Email: info@welljp.co.jp
http://well-teg.jp/

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