ウェル Company Overview

Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/

Well, Inc., a semiconductor advanced packaging solution provider specializing in test chips, will exhibit at the 27th Advanced Packaging Technology and Packaging Exhibition eX-tech2013, which will be held from June 5 (Wednesday) to June 7 (Friday), 2013, at Tokyo Big Sight. ■ Overview of the 27th Advanced Packaging Technology and Packaging Exhibition (eX-tech2013) [Dates] June 5 (Wednesday) to June 7 (Friday), 2013 - 3 days [Opening Hours] 10:00 AM to 5:00 PM [Venue] Tokyo Big Sight (3-21-1 Ariake, Koto-ku, Tokyo) [Booth] 3N-12 [Exhibit Contents] - High-density radical atmospheric pressure plasma equipment - TSV-equipped TEG chips for advanced packaging evaluation - TSV & MEMS processing services - Bump processing services ≪For inquiries regarding this matter≫ Well, Inc. Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennoz Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/

Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the "JPCA Show 2012" eX-tech 2012 booth, held at Tokyo Big Sight from June 13 (Wednesday) to June 15 (Friday), 2012. http://www.jpcashow.com/show2012/ At this exhibition, we will introduce silicon through-silicon vias (TSV) and TSV-TEG chips with bumps on both sides of the wafer, intended for 3D packaging and material development applications. ■ Overview of JPCA Show 2012 [Dates] June 13 (Wednesday) to June 15 (Friday), 2012 - 3 days [Opening Hours] 10:00 AM to 5:00 PM [Venue] Tokyo Big Sight (3-21-1 Ariake, Koto-ku, Tokyo) [Our Booth] 3F-33-19 【Contact Information for This Matter】 Well, Inc. Test Wafer Sales Department Tel: 03 (5715) 3501 Email: info@welljp.co.jp http://well-teg.jp/