【July 17, 2024 - July 19, 2024】Automotive Technology Exhibition 2024 NAGOYA: Displaying the high current compatible flexible substrate "BigElec" at the booth of Daitron Co., Ltd.

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

• Harness

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.

• Wiring materials

Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.

Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

• Printed Circuit Board

Flexible substrate that bends freely and supports high current! Easily connects in tight spaces! Big Elec SMT Connect.

Attention all users of electric wires, wire harnesses, busbars, and bus bars! "Big Elec SMT Connect" (High Current FPC Surface Mount Connector Split Specification) is a compact flexible circuit board that allows for high current wiring even in extremely small spaces, thanks to its flat shape. It can be offered as a solution that significantly enhances design flexibility. The highly flexible circuit board allows for component mounting and can be used in bent configurations, making installation in tight spaces easy. Furthermore, its thinness contributes to space-saving. We propose an excellent high current wiring solution. Please give Big Elec SMT Connect a try!

• power supply
• Other power sources

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Sanei Hitec Co., Ltd. will exhibit at SENSOR EXPO JAPAN 2025, which will be held from September 10 (Wednesday) to September 12 (Friday), 2025. At this Sensor EXPO 2025, we will showcase our semiconductor design technology and high-performance IP (Intellectual Property) that support the evolution of sensors.

Sanei Hightex Co., Ltd. will exhibit at the "Student Formula Japan Championship 2025" at the Shizuoka Prefecture booth in Aichi Sky Expo Exhibition Halls E and F from September 11 to 13, 2025.

We would like to inform you that we will be exhibiting our products at the 63rd Annual Meeting of the Biophysical Society of Japan. If you are planning to attend, please be sure to stop by. ❚ Products to be Exhibited - Auto Patch Clamp System | Port-a-Patch mini This compact system eliminates the need for a microscope, vibration isolation table, manipulator, and Faraday cage, which are typically required for conventional patch clamp experiments. It does not require specialized skills or experience, allowing for easy data acquisition and verification. - Artificial Lipid Bilayer Experiment Device | Orbit mini This device allows for easy measurement of channel activity at the single-molecule level. It enables the formation of lipid membranes, reconstitution of membrane proteins, and single-channel measurements using only a micropipette in experiments utilizing artificial lipid bilayers, facilitating functional and structural analysis of target membrane proteins and evaluation of drug effects. - Liposome Preparation Device | Vesicle Prep Pro This is the world's first device capable of producing giant unilamellar vesicles (GUVs) with diameters ranging from 1 to 30 μm without the use of organic solvents, utilizing the electroporation method (vibrating hydrated lipid films in an alternating electric field).

The success or failure of an AI project depends on the quality and immediacy of the "data infrastructure." By combining no-code and low-code products, it is possible to achieve a seamless process from data collection to integration and AI utilization, efficiently building a data infrastructure that supplies high-quality data to AI. We will explain specific methods for flexibly and quickly constructing a data infrastructure, incorporating case studies and demos, and introduce key points of a data strategy to lead to successful AI utilization.