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  1. Home
  2. Industrial Electrical Equipment
  3. ADLINKジャパン 東京本社
  4. ADLINK leads the embedded computing market with the 662-pin OSM form factor of the SGET standard.
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  • Jul 02, 2024
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Jul 02, 2024

ADLINK leads the embedded computing market with the 662-pin OSM form factor of the SGET standard.

ADLINKジャパン ADLINKジャパン 東京本社
The compact 45mm x 45mm Open Standard Module (OSM) streamlines production with a modular system that has no overhead, providing 662 pins for miniaturization and enhancement of IoT applications. ADLINK is a pioneer of the OSM form factor, offering the OSM-IMX93 and OSM-IMX8MP, each equipped with the NXP i.MX 93 and NXP i.MX 8M Plus, respectively, demonstrating continuous breakthroughs in embedded computing.
OSM
OSM
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ADLINK_PR_Jul 2nd_OSM_ADJ0702.pdf[1277445]

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ADLINK News Release
ADLINK leads the embedded computing market with the 662-pin OSM form factor of the SGET standard

Related product

OSM-IMX93-web-F.png

NXP i.MX93 series equipped OSM【OSM-IMX93】

NXP i.MX93 series processor equipped OSM R1.1 Size L module

The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.

  • Embedded Board Computers

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OSM-IMX8MP-web-F.png

NXP i.MX8M Plus equipped with OSM【OSM-IMX8MP】

NXP i.MX8M Plus series equipped OSM Size L module

The OSM-IMX8MP is an OSM R1.1 size-L module equipped with the NXP i.MX 8M Plus series processor featuring a 4-core Arm Cortex-A53 and M7, up to 8GB of LPDDR4L memory, and up to 128GB of eMMC storage. This module, which includes an InSoC 2.3 TOPS NPU and Vivante GC7000UL graphics, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX8MP module supports HDMI, LVDS, and DSI graphics outputs, 2x GbE (1 TSN compliant), 2x CAN bus, I2S audio codec interface, USB 3.0 and USB 2.0 interfaces, and MIPI-CSI, with a product supply capability of 15 years.

  • Embedded Board Computers

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Related catalog(2)

Open Standard Module with NXP i.MX93 Series Processor [OSM-IMX93]

Open Standard Module with NXP i.MX93 Series Processor [OSM-IMX93]

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Open standard module equipped with NXP i.MX8M Plus series【OSM-IMX8MP】

Open standard module equipped with NXP i.MX8M Plus series【OSM-IMX8MP】

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ADLINKジャパン
Industrial Electrical Equipment
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"Welding repair crack repair" We will repair metal cracks without applying heat.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

May 18, 2026

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Metal Crack Repair: MS Method for Repairing Cracks and Fractures in Machinery Equipment

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  • CATALOG

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for metal crack repair without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material with heat. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

May 18, 2026

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Electric design dedicated CAD solution "ECAD DCX" / Panel manufacturing support system "WIRE CAM DX"

We will exhibit our products at JECA FAIR 2026: Electrical Design CAD / Panel Manufacturing Support System.

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  • COMPANY

We will be exhibiting our products at "JECA FAIR 2026 (the 74th Electrical Construction Exhibition)" held at Tokyo Big Sight. At this exhibition, we will be jointly exhibiting with Mibu Electric Manufacturing. Our booth will focus on the "Panel Manufacturing Skill-less Solution," which addresses the labor shortage issues in panel manufacturing that have required skilled workers, enabling less experienced operators to achieve high-quality manufacturing in processes such as wire processing, component assembly, and wiring work. We will also introduce various other products. We invite you to visit our booth during your visit. ■ Exhibition Name: JECA FAIR 2026 (the 74th Electrical Construction Exhibition) ■ Location: Tokyo Big Sight, Halls 1-3 ■ Booth Numbers: 1-01 ECAD Solutions, 1-02 Joint Exhibition with Mibu Electric Manufacturing ■ Dates: May 27 (Wednesday) - May 29 (Friday), 2026, for three days ■ Hours: May 27 (Wednesday) 10:30 AM - 5:00 PM May 28 (Thursday) 10:00 AM - 5:00 PM May 29 (Friday) 10:00 AM - 4:30 PM *For more information about the exhibited products, please download the materials. Feel free to contact us with any inquiries.

May 18, 2026

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Consumables Campaign; Orders from June 1, 2026 (Monday) to September 30, 2026 (Wednesday) for ICP emission spectrometers and microwave sample digestion systems.

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We would like to express our gratitude for your continued support and announce a campaign where you can purchase consumables at a great price. We will offer various consumables that need to be replaced regularly for high-precision and stable analysis, as well as safe decomposition work, at a special price of 20% off. For more details, please refer to each leaflet.

May 18, 2026

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[Free Materials Available] Introducing Useful Information on Vehicle Detection Sensors!

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To customers considering the introduction of vehicle detection sensors for parking lot construction, design, and management: Are you facing any issues with the challenges you currently have or selecting the right sensors for parking lot management? Hotron offers free materials that explain how to utilize vehicle detection sensors and the benefits of their introduction! ▽ Here is the lineup of materials ◉ Basic Guide to Vehicle Detection Sensors This guide focuses on the challenges and solutions in parking lot operations, introducing the overview of vehicle detection sensors. ◉ Key Points for Introducing Vehicle Detection Sensors This material discusses the benefits of introduction based on installation locations and specific challenges. ◉ Case Studies of Vehicle Detection Sensor Implementation This document introduces the challenges before implementation and the results after introduction. For more details, please download from our website and check it out. https://www.hotron.co.jp/download/

May 18, 2026

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  • ダマになりやすい原料も 1台で解砕 ふるい分け カスタマイズ可能な回転羽根形状で様々な原料に対応!解砕機構付き佐藤式振動ふるい機 つばさ 活用イメージ動画を公開中!
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