[Completed] Exhibited at IMTS 2024 - International Manufacturing Technology Show

Direct printing of molds used for forming composite materials - Ultra-fast, large 3D printer - Features heat resistance, low thermal expansion coefficient, and isotropy.

■ Main Features (Massivit 10000) The Massivit 10000 is a molding system created using the CIM (Cast In Motion) method by Massivit 3D Printing Technologies Ltd., characterized by ultra-fast and large-scale additive manufacturing. It significantly reduces the time and cost of producing molds used for large and complex shapes made from composite materials (CFRP). The produced molds feature heat resistance, a low thermal expansion coefficient, and isotropy, making them suitable for autoclave molding. The higher model, Massivit 10000-G, can also be used as a 3D printer with materials similar to those of the Massivit 1800 / 5000 series, in addition to mold production.

• 3D Printer

3D Printer High Heat-Resistant Materials - Composite Molding Applications (Large Scale & High Speed)

■ Main Features CIM 220 is a 3D printing material that possesses high heat resistance (HDT 220°C), low thermal expansion coefficient, and isotropy (isotropic thermal and mechanical properties), making it suitable for composite material molding applications such as autoclave molding. It enables ultra-large and high-speed fabrication with the Massivit 10000 3D printer.

• plastic

Massivit's ultra-fast, large-scale 3D printer series - 2 print heads - lineup of high-precision, flame-retardant, heat-resistant, and impact-resistant materials.

■ Main Features The Massivit 5000 is the latest and top model from Massivit 3D Printing Technologies Ltd., characterized by ultra-fast and large-scale additive manufacturing using the GDP (Gel Dispensing Printing) method. It offers a wide range of materials with various properties such as high precision, flame resistance, heat resistance, and impact resistance. By using two print heads that simultaneously print with different materials, it achieves even faster production speeds. Its applications are diverse, including the production of large parts, prototype creation, and three-dimensional modeling for signs and displays. *In the GDP (Gel Dispensing Printing) method, a viscous gel-like resin is extruded from the print head and instantly cured with UV light, enabling significantly faster manufacturing compared to other methods.

• 3D Printer

3D Printer Flame Retardant Materials - Applications for Theme Parks and Other Sculptures (Large Scale & High Speed)

■ Main Features CIM 84 is a 3D printing material that complies with ASTM E84 Class A (highest grade) fire resistance standards. The Massivit 10000 3D printer enables ultra-large and high-speed manufacturing.

• plastic

3D Printer Impact-Resistant and Heat-Resistant Resin - High-Speed Integrated Molding for Large Prototypes, Actual Products, and Master Molds

■ Main Features Dimengel 400 is a 3D printing material with excellent impact resistance and heat resistance, designed for industrial applications. It enables ultra-large and high-speed modeling with the Massivit 5000 and Massivit 10000-G 3D printers. * For a lineup of other resin materials that can be used with Massivit 3D printers (such as high precision, flame retardant, transparent, etc.), please refer to the related links.

• plastic

We will hold an online seminar as follows. The corporate perspective on the introduction of monitoring systems is changing year by year. We will explain the monitoring systems for machine tools that are currently needed, using various case studies to discuss the changes in the industry environment, what challenges customers perceive, their expectations for monitoring systems, and the effects of their implementation. This seminar will provide insights into specific approaches for your company's introduction of monitoring systems. Date and Time: February 12, 2025 (Thursday) 14:00 - 15:00 Instructor: Monitoring System Representative, ARTIS (MARPOSS Corporation Sales Development Department) Target Audience: - Customers considering the introduction of monitoring systems who want to know the specific process leading to implementation. - Customers interested in what challenges other companies have identified that led to the introduction of monitoring systems. - Customers researching the latest trends in monitoring systems for machine tools. We sincerely look forward to your participation.

■Title: "Fluorine-Free Water and Oil Repellent Treatment Technology Achievable - Guidelines and Examples for Surface Design to Improve Wetting Fundamentals and Liquid Sliding Properties" As PFAS regulations accelerate, surface designs that achieve water and oil repellency without fluorine are gaining attention. This seminar will systematically explain the fundamentals of wetting, dynamic wettability evaluation, design guidelines for improving sliding properties, and the latest examples of fluorine-free surface treatments by leading researchers. ■Date and Time: April 14, 2026 (Tuesday) 13:30 - 16:30 ■Target Audience for the Seminar - Individuals engaged in surface treatment and modification operations - Those involved in research and development related to imparting water and oil repellency, stain resistance, and anti-adhesion properties to various substrate surfaces - Individuals engaged in research and development of fluorine (PFAS) alternative technologies and fluorine-free surface treatment and modification technologies ■Knowledge Gained from the Seminar - Fundamental knowledge/theory regarding wettability - Correct knowledge of wettability evaluation techniques (static/dynamic contact angle, contact angle hysteresis, sliding/falling angle) - Know-how for creating surfaces/interfaces with excellent water and oil repellency, stain resistance, and anti-adhesion properties without fluorine

The "Jumbo Surprise Exhibition," which solves the challenges faced by the manufacturing industry all at once, will be held again this year. In the FA zone, the latest FA equipment, control and drive devices, and energy-saving and labor-saving proposals will be displayed all in one place. You can experience concrete solutions that are immediately useful on-site, such as automation, productivity improvement, equipment renewal, and maintenance efficiency. Representatives from each manufacturer will be available to provide direct explanations, making it a great opportunity to learn about the latest trends and case studies. If you are looking for hints to solve your challenges or considering new equipment investments, please come and visit us. We will provide encounters that will lead your business to the next stage.

■Title: "Flexible Substrates and FPC Formation Technology for 5G/6G - LCP-FCCL and Its Development" ――A must-see for developers of high-frequency FPCs. Provides knowledge useful for future FPC substrate design, from the key technologies for LCP multilayering to examples of new low-dielectric films. ■Date and Time: April 15, 2026 (Wednesday) 13:30 - 16:30 ■Target Audience for the Seminar 　Development engineers engaged in the development of high-frequency FPCs and their substrates ■Knowledge Gained from the Seminar 　・Basic properties required for FPC substrates 　・Reasons for using LCP and polyimide films in FPCs 　・Key technologies for LCP multilayering 　・Points to consider when processing LCP films 　・Examples of hybridization methods between LCP and low-dielectric materials

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. A leading expert thoroughly organizes practical perspectives from WLP/PLP to high thermal conductivity materials. ■ Title: Basic Information on Semiconductor Packaging Technology: Comprehensive Explanation ■ Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM ■ Target Audience for the Seminar - Individuals involved in semiconductor packaging (sales, technology) - Those interested in semiconductor packaging technology - Those interested in semiconductor resin encapsulation and encapsulation materials ■ Knowledge Gained from the Seminar - Development history of semiconductor packaging (PKG) - Development history of semiconductor packaging technology (methods, materials) - Specifications of semiconductor encapsulation materials (raw materials, composition, manufacturing equipment, evaluation methods, etc.)