ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!

NXP i.MX93 series processor equipped OSM R1.1 Size L module

The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.

• Embedded Board Computers

COM-HPC Server Size E module equipped with Ampere Altra SoC

ADLINK's "COM-HPC-ALT" is the world's first 80-core COM-HPC server-type module. Based on the Ampere Altra SoC, which utilizes the Arm Neoverse N1 architecture, it features up to 80 Arm v8.2 64-bit cores running at 2.8GHz, with a TDP of just 175 watts. The COM-HPC Ampere Altra, which adopts an architecture with excellent performance per watt, is suitable for massive data processing at the edge without requiring significant initial investment or ongoing maintenance costs. The COM-HPC-ALT has been certified as compliant with the Arm SystemReady program, supporting common operating systems and subsequent software layers, ensuring a seamless user experience. When combined with the open-source EDKII project, this module supports operating systems such as CentOS, Ubuntu, and Yocto Linux.

• Embedded Board Computers

[Sample available for loan] I-Pi SMARC development kit equipped with NXP i.MX8M Plus Quad Arm Cortex-A53 processor

The I-Pi SMARC IMX8M Plus is a SMARC-based smart solution development kit equipped with the NXP i.MX8M Plus (Quad-core Arm Cortex-A53) processor and an NPU (Neural Processing Unit) capable of up to 2.3 TOPS. This product is the first in a series of highly reliable SMARC R2.1 development kits focused on machine learning, vision, advanced multimedia, and industrial IoT. Therefore, it supports dual image processors and two camera inputs, enabling an effective Vision System, while also accommodating future applications such as smart homes, building cities, and Industry 4.0.

• Embedded Board Computers

[Sample available for loan] Qualcomm Robotics RB5 platform-based I-Pi SMARC development kit

The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit that leverages the ADLINK LEC-RB5, powered by the Qualcomm QRB5165 SoC featuring a Qualcomm Kyro 585 octa-core CPU (8x Arm Cortex-A77) and Qualcomm AI Engine. Supporting up to six MIPI-CSI cameras and achieving 15 TOPS, the I-Pi SMARC RB5 is an ideal DevKit for implementing AI-centric robotics and drone applications in various fields such as consumer, enterprise, defense, industrial, and logistics.

• Embedded Board Computers

[Sample available for loan] MediaTek Genio 1200 platform-based I-Pi SMARC development kit

The I-Pi SMARC 1200 is a SMARC-based AI and graphics-centric solution development kit equipped with the MediaTek Genio 1200 (octa-core Arm Cortex-A78 x4 + A55 x4) processor, an advanced 5-core Arm Mali-G57 GPU for high-quality 3D graphics, and an integrated APU (AI Processor Unit) system with up to 5 TOPS. This development kit features AI processing capabilities on the device (acceleration for deep learning neural networking, computer vision, etc.), support for multiple 4K displays, and up to three MIPI camera inputs, making it an optimal solution for enabling various next-generation innovations focused on AI, such as advanced smart homes, human-machine interfaces, 4K multimedia applications, and industrial IoT.

• Industrial PCs
• Embedded Board Computers

NXP i.MX8M Plus quad-core processor-based IIoT gateway platform

The MXA-200 is a high-performance IoT gateway based on the i.MX8M Plus, featuring a quad-core processor, two isolated RS-232/422/485 serial ports, two 10/100/1000 Ethernet ports, two USB 3.0 ports, and an operating temperature range of -20 to 70°C. It also includes two M.2 slots for integrating Wi-Fi/4G/5G modules. With the MXA-200, system integrators can accurately develop applications for renewable energy, EV chargers, smart cities, and factories that require large-scale data collection, cloud-based applications, and video-related monitoring solutions.

• Industrial PCs

Ampere Altra SoC-based COM-HPC Server Size E reference development platform

The Ampere Altra developer platform, based on the Ampere Altra SoC and supported by a wide range of the Arm ecosystem using the Arm Neoverse N1 platform, delivers premium performance from cloud to edge infrastructure while maintaining an extremely low thermal envelope, low TCO, and significantly lower power consumption compared to x86 designs. It supports the open-source EDKII as a UEFI bootloader, allowing customers to simply download a pure AArch64 (arm64) ISO, such as Ubuntu, and boot the live ISO directly on the target for installation. This is the same convenience we have become accustomed to with x86/amd64 target systems. If you would like to request a sample loan, please feel free to contact us.

• Embedded Board Computers

We will be exhibiting at the "Kyushu Printing Information Industry Exhibition 2026" held at the Fukuoka International Center. During the event, we will showcase various products. We invite all related parties to come together and visit us. 【Suppliers】 ・Laser-X

This year, Toyota Kikan will exhibit at the Toyota Business Fair. We will introduce products that are useful for heatstroke prevention and more. Our top recommendation is SPACECOOL. Please feel free to visit our booth! SPACECOOL is an "eco-friendly cooling solution" essential for the future of our planet's environment! Be sure to check it out. Also, take a look at the basic knowledge for heat prevention in factories moving forward.

In the operation of drawings, do you face challenges such as "taking too long to find," "uncertainty about whether it's the latest version," or "high likelihood of confirmation errors"? By utilizing CADSUPER's barcode function (optional), you can reliably connect drawings and information, allowing for a smooth advancement of DX in drawing utilization. In this seminar, we will introduce how using barcodes can change: - Drawing management and search - Confirmation and cross-checking tasks - Information collaboration with the field This content is recommended not only for existing users but also for those considering improving the efficiency of drawing operations and reducing errors.

Daitō Shikō Co., Ltd. will be exhibiting at the "International Fire and Disaster Prevention Exhibition" held at Shirakawa Park in Nagoya City, Aichi Prefecture, from Thursday, May 28, 2026. At the exhibition venue, we plan to showcase goods that are perfect for fire prevention events and recruitment activities for members. If you are looking for SP tools, promotional items, or novelties, please be sure to visit our booth.

[Speaker] Miho Ko Shimada, Partner Attorney, Mori Hamada & Matsumoto Law Firm, Foreign Law Joint Enterprise [Key Lecture Content] The movement towards the implementation of CCS, which is positioned as an essential technology for decarbonizing hard-to-abate industries, is gaining momentum in Japan. Among the "advanced CCS projects" selected for business commencement in the early 2030s, some pipeline projects have progressed to the exploratory drilling stage. For shipping transport projects, discussions are underway to create mechanisms for clustering CO2 sources and improving shipping transport efficiency. In this seminar, following the full enforcement of the CCS Business Act on May 22, we will organize the current state of the business environment related to CCS and examine the latest discussions at the Agency for Natural Resources and Energy and the Ministry of the Environment (based on information available at the time of the event) from a legal perspective as we consider the shape of CCS projects leading to Final Investment Decision (FID). [Lecture Items] 1. Current state of the business environment related to CCS 2. Overview of the CCS Business Act 3. Overview of the cost difference support system for CCS projects (pipelines) 4. Structural considerations through the CCS value chain 5. Q&A / Business card exchange