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  1. Home
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  3. ADLINKジャパン 東京本社
  4. ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!
SEMINAR_EVENT
  • Oct 17, 2024
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Oct 17, 2024

ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!

ADLINKジャパン ADLINKジャパン 東京本社
On November 7, 2024 (Thursday), the "Arm Tech Symposia Tokyo" will be held at the Tokyo Conference Center, Shinagawa. This event will feature keynote speeches, panel sessions, and breakout sessions by Arm executives and guest speakers, and ADLINK plans to showcase a variety of Arm-based products. 【Exhibited Products】 OSM Module【OSM-IMX93】 COM-HPC Module【COM-HPC-ALT】 SMARC Module【LEC-IMX95】 Development Kit【I-Pi SMARC IMX8MP】 Development Kit【I-Pi SMARC RB5】 Development Kit【I-Pi SMARC 1200】 IoT Gateway【MXA-200】 Ampere Altra Developer Platform【AADP】
Date and time Thursday, Nov 07, 2024
10:00 AM ~ 06:00 PM
Capital 【Venue and Date】 ●Event Name: Arm Tech Symposia Tokyo ●Date and Time: November 7, 2024 (Thursday) 10:00 AM - 6:00 PM (tentative) ●Location: Tokyo Conference Center, Shinagawa ●Address: 1-9-36 Konan, Minato-ku, Tokyo 108-0075, Area Shinagawa 3F-5F
Entry fee Free Free for pre-registration.
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OSM-IMX93-web-F.png

NXP i.MX93 series equipped OSM【OSM-IMX93】

NXP i.MX93 series processor equipped OSM R1.1 Size L module

The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.

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COM-HPC_Ampere Altra_F.jpg

COM-HPC Server Module: COM-HPC-ALT

COM-HPC Server Size E module equipped with Ampere Altra SoC

ADLINK's "COM-HPC-ALT" is the world's first 80-core COM-HPC server-type module. Based on the Ampere Altra SoC, which utilizes the Arm Neoverse N1 architecture, it features up to 80 Arm v8.2 64-bit cores running at 2.8GHz, with a TDP of just 175 watts. The COM-HPC Ampere Altra, which adopts an architecture with excellent performance per watt, is suitable for massive data processing at the edge without requiring significant initial investment or ongoing maintenance costs. The COM-HPC-ALT has been certified as compliant with the Arm SystemReady program, supporting common operating systems and subsequent software layers, ensuring a seamless user experience. When combined with the open-source EDKII project, this module supports operating systems such as CentOS, Ubuntu, and Yocto Linux.

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SMARC Development Kit I-Pi SMARC IMX8M Plus

[Sample available for loan] I-Pi SMARC development kit equipped with NXP i.MX8M Plus Quad Arm Cortex-A53 processor

The I-Pi SMARC IMX8M Plus is a SMARC-based smart solution development kit equipped with the NXP i.MX8M Plus (Quad-core Arm Cortex-A53) processor and an NPU (Neural Processing Unit) capable of up to 2.3 TOPS. This product is the first in a series of highly reliable SMARC R2.1 development kits focused on machine learning, vision, advanced multimedia, and industrial IoT. Therefore, it supports dual image processors and two camera inputs, enabling an effective Vision System, while also accommodating future applications such as smart homes, building cities, and Industry 4.0.

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I-Pi_SMARC_RB5-set.jpg

SMARC Development Kit I-Pi SMARC RB5

[Sample available for loan] Qualcomm Robotics RB5 platform-based I-Pi SMARC development kit

The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit that leverages the ADLINK LEC-RB5, powered by the Qualcomm QRB5165 SoC featuring a Qualcomm Kyro 585 octa-core CPU (8x Arm Cortex-A77) and Qualcomm AI Engine. Supporting up to six MIPI-CSI cameras and achieving 15 TOPS, the I-Pi SMARC RB5 is an ideal DevKit for implementing AI-centric robotics and drone applications in various fields such as consumer, enterprise, defense, industrial, and logistics.

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SMARC Development Kit I-Pi SMARC 1200

[Sample available for loan] MediaTek Genio 1200 platform-based I-Pi SMARC development kit

The I-Pi SMARC 1200 is a SMARC-based AI and graphics-centric solution development kit equipped with the MediaTek Genio 1200 (octa-core Arm Cortex-A78 x4 + A55 x4) processor, an advanced 5-core Arm Mali-G57 GPU for high-quality 3D graphics, and an integrated APU (AI Processor Unit) system with up to 5 TOPS. This development kit features AI processing capabilities on the device (acceleration for deep learning neural networking, computer vision, etc.), support for multiple 4K displays, and up to three MIPI camera inputs, making it an optimal solution for enabling various next-generation innovations focused on AI, such as advanced smart homes, human-machine interfaces, 4K multimedia applications, and industrial IoT.

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IIoT Gateway MXA-200

NXP i.MX8M Plus quad-core processor-based IIoT gateway platform

The MXA-200 is a high-performance IoT gateway based on the i.MX8M Plus, featuring a quad-core processor, two isolated RS-232/422/485 serial ports, two 10/100/1000 Ethernet ports, two USB 3.0 ports, and an operating temperature range of -20 to 70°C. It also includes two M.2 slots for integrating Wi-Fi/4G/5G modules. With the MXA-200, system integrators can accurately develop applications for renewable energy, EV chargers, smart cities, and factories that require large-scale data collection, cloud-based applications, and video-related monitoring solutions.

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COM-HPC Server Development Kit AADP [Sample Available for Loan]

Ampere Altra SoC-based COM-HPC Server Size E reference development platform

The Ampere Altra developer platform, based on the Ampere Altra SoC and supported by a wide range of the Arm ecosystem using the Arm Neoverse N1 platform, delivers premium performance from cloud to edge infrastructure while maintaining an extremely low thermal envelope, low TCO, and significantly lower power consumption compared to x86 designs. It supports the open-source EDKII as a UEFI bootloader, allowing customers to simply download a pure AArch64 (arm64) ISO, such as Ubuntu, and boot the live ISO directly on the target for installation. This is the same convenience we have become accustomed to with x86/amd64 target systems. If you would like to request a sample loan, please feel free to contact us.

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Related catalog(8)

Open Standard Module with NXP i.MX93 Series Processor [OSM-IMX93]

Open Standard Module with NXP i.MX93 Series Processor [OSM-IMX93]

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COM-HPC Server Size E Module【COM-HPC-ALT】

COM-HPC Server Size E Module【COM-HPC-ALT】

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LEC-IMX95

LEC-IMX95

DOCUMENT
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SMARC Development Kit I-Pi SMARC IMX8M Plus

SMARC Development Kit I-Pi SMARC IMX8M Plus

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SMARC Development Kit I-Pi SMARC RB5

SMARC Development Kit I-Pi SMARC RB5

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SMARC Development Kit I-Pi SMARC 1200

SMARC Development Kit I-Pi SMARC 1200

DOCUMENT
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IIoT Gateway MXA-200

IIoT Gateway MXA-200

DOCUMENT
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COM-HPC Server Development Kit [Ampere Altra Developer Platform (AADP)]

COM-HPC Server Development Kit [Ampere Altra Developer Platform (AADP)]

DOCUMENT
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ADLINKジャパン
Industrial Electrical Equipment
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Notice of Participation in the "Advanced Power Semiconductor Subcommittee 12th Lecture" on November 19 (Wednesday) and 20 (Thursday), 2025.

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  • SEMINAR_EVENT

We will be exhibiting at the "12th Conference of the Advanced Power Semiconductor Subcommittee" held at the Toyama International Conference Center. We will be introducing our latest analysis technology services, so please stop by! We sincerely look forward to your visit.

Oct 17, 2025

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Measurement and Measurement Comprehensive Technology Exhibition in Hokuriku

[Line Seiki] "Measurement and Measurement Comprehensive Technology Exhibition in Hokuriku" Exhibition Announcement

  • NEW
  • SEMINAR_EVENT

Our company will exhibit at the Measurement and Measurement Comprehensive Technology Exhibition in Hokuriku, showcasing safety products with Gemba Reporter. Please be sure to stop by booth number "72" when you visit. 【Date and Time】 November 6, 2025 (Thursday) 9:00 AM - 5:00 PM 【Venue】 Ishikawa Industrial Exhibition Hall, Building 2 From JR Kanazawa Station, take the Hokutetsu Bus bound for "Shimo-Yasuhara" and get off at "Fukurobatake Town West Green Park," then walk for 5 minutes. Alternatively, take the Hokutetsu Bus bound for "Saiseikai Hospital," get off at "Seibu Green Park," and it will take about 15 minutes by taxi. 【Materials】 https://www.line.co.jp/wp-content/uploads/2025/10/MepTechhokuriku2025.pdf 【Notes】 Please register in advance using the 2D barcode in the PDF.

Oct 17, 2025

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[October 31, 2025 (Friday)] Notice of participation in the "Environmental Industry Expo 2025"

  • NEW
  • SEMINAR_EVENT

Sekiguchi Iron Works Co., Ltd. will exhibit at the "Environmental Industry Expo 2025" held at S-Bird in Iida City, Nagano Prefecture. This exhibition aims to pave the way for a sustainable future from the local community. It is a trade fair for environmental-related industries originating from the Minami-Shinshu region of Nagano Prefecture. Our company will introduce next-generation solutions for reducing environmental impact and effectively utilizing energy, including our "smokeless small incinerator" and "stove," along with product panels and case studies. No pre-registration is required, and admission is free. We sincerely look forward to your visit.

Oct 17, 2025

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November 10 (Monday) Webinar "Basics and Use Cases of Fine Bubbles"

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  • SEMINAR_EVENT

Recently, fine bubbles, which are tiny bubbles smaller than 100 μm and are referred to as "fine bubbles," have attracted attention in various fields such as the environment, agriculture, food, fisheries, and medicine, due to their ability to impart various functions to liquids. Fine bubbles are classified into two types based on their size: microbubbles and ultrafine bubbles. Recently, there has been a growing interest in ultrafine bubbles, which have a lifespan of several weeks to months. However, listening to the voices of researchers and users reveals some skepticism, which has become one of the issues hindering the spread of fine bubble technology. On the other hand, we have challenged the elucidation of the stabilization mechanism of ultrafine bubbles from a new perspective by enabling the control of number density exceeding 10 billion particles/mL without pressure or concentration operations using our ultrafine bubble generation technology. In this seminar, we will provide a fundamental explanation of fine bubble technology, including the basic physical properties, characteristics and functions, device technology, measurement and evaluation methods, and case studies, to promote research and utilization of fine bubbles based on a correct understanding.

Oct 17, 2025

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Notice of Participation in the 'Minami Shinshu Environmental Messe 2025' from November 1 (Saturday) to November 2 (Sunday), 2025

  • NEW
  • SEMINAR_EVENT

Sekiguchi Iron Works Co., Ltd. will exhibit at the "Minami-Shinshu Environmental Messe 2025" held at S-Bird in Iida City, Nagano Prefecture. This exhibition will be held simultaneously with the "Environmental Industry Trade Fair" taking place the day before. It will be held over the weekend, with many family-friendly events planned. We encourage those who usually find it difficult to visit to take this opportunity to come. Our product exhibition area is located about 10 minutes from the venue. We sincerely look forward to your visit.

Oct 17, 2025

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