ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!

NXP i.MX93 series processor equipped OSM R1.1 Size L module

The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.

• Embedded Board Computers

COM-HPC Server Size E module equipped with Ampere Altra SoC

ADLINK's "COM-HPC-ALT" is the world's first 80-core COM-HPC server-type module. Based on the Ampere Altra SoC, which utilizes the Arm Neoverse N1 architecture, it features up to 80 Arm v8.2 64-bit cores running at 2.8GHz, with a TDP of just 175 watts. The COM-HPC Ampere Altra, which adopts an architecture with excellent performance per watt, is suitable for massive data processing at the edge without requiring significant initial investment or ongoing maintenance costs. The COM-HPC-ALT has been certified as compliant with the Arm SystemReady program, supporting common operating systems and subsequent software layers, ensuring a seamless user experience. When combined with the open-source EDKII project, this module supports operating systems such as CentOS, Ubuntu, and Yocto Linux.

• Embedded Board Computers

[Sample available for loan] I-Pi SMARC development kit equipped with NXP i.MX8M Plus Quad Arm Cortex-A53 processor

The I-Pi SMARC IMX8M Plus is a SMARC-based smart solution development kit equipped with the NXP i.MX8M Plus (Quad-core Arm Cortex-A53) processor and an NPU (Neural Processing Unit) capable of up to 2.3 TOPS. This product is the first in a series of highly reliable SMARC R2.1 development kits focused on machine learning, vision, advanced multimedia, and industrial IoT. Therefore, it supports dual image processors and two camera inputs, enabling an effective Vision System, while also accommodating future applications such as smart homes, building cities, and Industry 4.0.

• Embedded Board Computers

[Sample available for loan] Qualcomm Robotics RB5 platform-based I-Pi SMARC development kit

The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit that leverages the ADLINK LEC-RB5, powered by the Qualcomm QRB5165 SoC featuring a Qualcomm Kyro 585 octa-core CPU (8x Arm Cortex-A77) and Qualcomm AI Engine. Supporting up to six MIPI-CSI cameras and achieving 15 TOPS, the I-Pi SMARC RB5 is an ideal DevKit for implementing AI-centric robotics and drone applications in various fields such as consumer, enterprise, defense, industrial, and logistics.

• Embedded Board Computers

[Sample available for loan] MediaTek Genio 1200 platform-based I-Pi SMARC development kit

The I-Pi SMARC 1200 is a SMARC-based AI and graphics-centric solution development kit equipped with the MediaTek Genio 1200 (octa-core Arm Cortex-A78 x4 + A55 x4) processor, an advanced 5-core Arm Mali-G57 GPU for high-quality 3D graphics, and an integrated APU (AI Processor Unit) system with up to 5 TOPS. This development kit features AI processing capabilities on the device (acceleration for deep learning neural networking, computer vision, etc.), support for multiple 4K displays, and up to three MIPI camera inputs, making it an optimal solution for enabling various next-generation innovations focused on AI, such as advanced smart homes, human-machine interfaces, 4K multimedia applications, and industrial IoT.

• Industrial PCs
• Embedded Board Computers

NXP i.MX8M Plus quad-core processor-based IIoT gateway platform

The MXA-200 is a high-performance IoT gateway based on the i.MX8M Plus, featuring a quad-core processor, two isolated RS-232/422/485 serial ports, two 10/100/1000 Ethernet ports, two USB 3.0 ports, and an operating temperature range of -20 to 70°C. It also includes two M.2 slots for integrating Wi-Fi/4G/5G modules. With the MXA-200, system integrators can accurately develop applications for renewable energy, EV chargers, smart cities, and factories that require large-scale data collection, cloud-based applications, and video-related monitoring solutions.

• Industrial PCs

Ampere Altra SoC-based COM-HPC Server Size E reference development platform

The Ampere Altra developer platform, based on the Ampere Altra SoC and supported by a wide range of the Arm ecosystem using the Arm Neoverse N1 platform, delivers premium performance from cloud to edge infrastructure while maintaining an extremely low thermal envelope, low TCO, and significantly lower power consumption compared to x86 designs. It supports the open-source EDKII as a UEFI bootloader, allowing customers to simply download a pure AArch64 (arm64) ISO, such as Ubuntu, and boot the live ISO directly on the target for installation. This is the same convenience we have become accustomed to with x86/amd64 target systems. If you would like to request a sample loan, please feel free to contact us.

• Embedded Board Computers

We will be exhibiting at the "1st [Nagoya] High-Performance Plastics Exhibition -PLASTIC JAPAN-" held at Port Messe Nagoya. We will introduce samples and characteristics of our carbon nanofibers blended with various resins. The conductive carbon nanofiber (high dispersion) ALP-NK1 (550W/mK) has also been added to our product lineup, and we will propose materials tailored to customer needs, starting with heat dissipation applications. Additionally, we will showcase extruded round bars of PEEK blended with carbon nanofibers and their processed products, as well as doctor blades designed for battery materials. As a business model for our nanomaterial business, we offer sales of CNF powder and prototype sales of resin blends (pellets and liquid resins) according to customer requests. Furthermore, we will introduce various silicon materials, including silicon monoxide, which is gaining attention as electrode materials for high-capacity lithium-ion secondary batteries, as well as magnesium balls. We welcome various requests regarding compounds, alloys, purity, particle size, and shapes, so please feel free to stop by our booth for consultation. We sincerely look forward to your visit.

Our company will be exhibiting at the "Fukushima Tech Create 2026 Results Presentation" held in Okuma Town, Fukushima Prefecture. At this event, promising startups aiming for entrepreneurship and technological development in areas such as Hamadori, Fukushima Prefecture, will present their research and business results. ★ Participating Industry Fields Decommissioning / Robotics and Drones / Energy, Environment, and Recycling Agriculture, Forestry, and Fisheries / Medical-related / Aerospace On the 29th (Thursday), a talk event featuring notable figures and local entrepreneurs will also be held. A collection of attention-grabbing technologies that will shape the future will be gathered, so please feel free to stop by the IIDA booth when you visit. [Limited Company Iida Seisakusho Fukushima No. 2 Factory] 〒969-1204 21-2 Mizukami, Nukazawa, Motomiya City, Fukushima Prefecture TEL: 0243-64-2320 FAX: 0243-64-2571

Our company will be exhibiting at the "New Functional Materials Exhibition 2025," which will be held at Tokyo Big Sight starting from January 29, 2025 (Wednesday). We would be delighted if you could visit us at the venue if you have the time. ┏━━━━━━━━━━━━━━━━━━━━━━━━━━ ■ Exhibition Information Details ┗━━━━━━━━━━━━━━━━━━━━━━━━━━ Exhibition Name: "New Functional Materials Exhibition 2025" Exhibition Venue: Tokyo Big Sight, East Hall 5 Booth Number: 5W-23 Teijin/Teijin Frontier Co., Ltd. Event Dates: January 29 (Wednesday) to 31 (Friday), 2025, 10:00 AM to 5:00 PM ■ About the Exhibited Products At this exhibition, we will broadly introduce our newly developed high-performance non-woven fabrics. We will showcase ultra-thin and ultra-light non-woven fabrics, newly developed marine biodegradable PLA, carbon paper, porous high-performance membrane "MiraimⓇ," graphene heat dissipation paint that enhances heat dissipation effects and lowers the temperature of objects, heat dissipation and electromagnetic wave absorption sheets, water treatment technology, oil-water separation technology, and various other new high-performance products. All of our exhibition staff sincerely look forward to your visit.

Our company will be exhibiting at the "1st Mobility Material Exhibition during High-Performance Material Week." We sincerely look forward to your visit.

[Speaker] Yuichi Ikejiro, Deputy Director, Innovation Center, NTT Docomo Business Inc. [Key Lecture Content] NTT Docomo Business is responsible for corporate ICT business within the NTT Group. It provides a one-stop solution for corporate clients across the entire group, aiming to solve social issues and become a platform for industrial and regional digital transformation (DX) through support for large enterprises and local small and medium-sized enterprises. In this context, the Innovation Center plays a role in exploring and nurturing new business ideas, driving the creation of new businesses and their implementation in society. In this lecture, I would like to introduce the initiatives aimed at creating new businesses utilizing advanced technologies such as AI and IOWN that are promoted by the Innovation Center. [Lecture Items] 1. About NTT Docomo Business / Innovation Center 2. Technology roadmap looking towards 2030 3. Creation of new businesses through open innovation 4. Value creation promoted through design thinking 5. Initiatives for business creation utilizing advanced technologies such as AI, IoT/OT, and IOWN 6. Q&A / Business card exchange