ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!

NXP i.MX93 series processor equipped OSM R1.1 Size L module

The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.

• Embedded Board Computers

COM-HPC Server Size E module equipped with Ampere Altra SoC

ADLINK's "COM-HPC-ALT" is the world's first 80-core COM-HPC server-type module. Based on the Ampere Altra SoC, which utilizes the Arm Neoverse N1 architecture, it features up to 80 Arm v8.2 64-bit cores running at 2.8GHz, with a TDP of just 175 watts. The COM-HPC Ampere Altra, which adopts an architecture with excellent performance per watt, is suitable for massive data processing at the edge without requiring significant initial investment or ongoing maintenance costs. The COM-HPC-ALT has been certified as compliant with the Arm SystemReady program, supporting common operating systems and subsequent software layers, ensuring a seamless user experience. When combined with the open-source EDKII project, this module supports operating systems such as CentOS, Ubuntu, and Yocto Linux.

• Embedded Board Computers

[Sample available for loan] I-Pi SMARC development kit equipped with NXP i.MX8M Plus Quad Arm Cortex-A53 processor

The I-Pi SMARC IMX8M Plus is a SMARC-based smart solution development kit equipped with the NXP i.MX8M Plus (Quad-core Arm Cortex-A53) processor and an NPU (Neural Processing Unit) capable of up to 2.3 TOPS. This product is the first in a series of highly reliable SMARC R2.1 development kits focused on machine learning, vision, advanced multimedia, and industrial IoT. Therefore, it supports dual image processors and two camera inputs, enabling an effective Vision System, while also accommodating future applications such as smart homes, building cities, and Industry 4.0.

• Embedded Board Computers

[Sample available for loan] Qualcomm Robotics RB5 platform-based I-Pi SMARC development kit

The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit that leverages the ADLINK LEC-RB5, powered by the Qualcomm QRB5165 SoC featuring a Qualcomm Kyro 585 octa-core CPU (8x Arm Cortex-A77) and Qualcomm AI Engine. Supporting up to six MIPI-CSI cameras and achieving 15 TOPS, the I-Pi SMARC RB5 is an ideal DevKit for implementing AI-centric robotics and drone applications in various fields such as consumer, enterprise, defense, industrial, and logistics.

• Embedded Board Computers

[Sample available for loan] MediaTek Genio 1200 platform-based I-Pi SMARC development kit

The I-Pi SMARC 1200 is a SMARC-based AI and graphics-centric solution development kit equipped with the MediaTek Genio 1200 (octa-core Arm Cortex-A78 x4 + A55 x4) processor, an advanced 5-core Arm Mali-G57 GPU for high-quality 3D graphics, and an integrated APU (AI Processor Unit) system with up to 5 TOPS. This development kit features AI processing capabilities on the device (acceleration for deep learning neural networking, computer vision, etc.), support for multiple 4K displays, and up to three MIPI camera inputs, making it an optimal solution for enabling various next-generation innovations focused on AI, such as advanced smart homes, human-machine interfaces, 4K multimedia applications, and industrial IoT.

• Industrial PCs
• Embedded Board Computers

NXP i.MX8M Plus quad-core processor-based IIoT gateway platform

The MXA-200 is a high-performance IoT gateway based on the i.MX8M Plus, featuring a quad-core processor, two isolated RS-232/422/485 serial ports, two 10/100/1000 Ethernet ports, two USB 3.0 ports, and an operating temperature range of -20 to 70°C. It also includes two M.2 slots for integrating Wi-Fi/4G/5G modules. With the MXA-200, system integrators can accurately develop applications for renewable energy, EV chargers, smart cities, and factories that require large-scale data collection, cloud-based applications, and video-related monitoring solutions.

• Industrial PCs

Ampere Altra SoC-based COM-HPC Server Size E reference development platform

The Ampere Altra developer platform, based on the Ampere Altra SoC and supported by a wide range of the Arm ecosystem using the Arm Neoverse N1 platform, delivers premium performance from cloud to edge infrastructure while maintaining an extremely low thermal envelope, low TCO, and significantly lower power consumption compared to x86 designs. It supports the open-source EDKII as a UEFI bootloader, allowing customers to simply download a pure AArch64 (arm64) ISO, such as Ubuntu, and boot the live ISO directly on the target for installation. This is the same convenience we have become accustomed to with x86/amd64 target systems. If you would like to request a sample loan, please feel free to contact us.

• Embedded Board Computers

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

When conducting structural analysis of organic compounds, IR, NMR, and MS can be considered the three sacred treasures. If the analysis is performed correctly, it is possible to elucidate the structure of even quite complex compounds. However, actual spectra are often not of a single compound, as seen in textbooks, which can lead to significant challenges in interpreting results for beginners in analysis. Additionally, while database searches are a useful tool in structural analysis, the ability to read spectra is necessary to select the correct structure from among the candidates, not just pattern matching. In this course, we will lecture on the basic ways to interpret IR, NMR, and MS spectra, including simple explanations of principles, points to be aware of during analysis, and how to proceed with actual analysis, incorporating some exercises as well.

◆Mechatrotech Japan 2025 —◆ Troax Safety Systems Co., Ltd. will be exhibiting at "Mechatrotech Japan 2025." ■ When it comes to steel safety fences, think "TROAX" - We will showcase steel safety fences used around robots, equipment, and conveyor lines. ■ The safety guard "FlexGuard" absorbs impact with flexible materials and boasts excellent durability - This safety guard ensures the safety of workers in environments where people and "machines/vehicles" interact, such as manufacturing sites, truck areas, and packing areas. At our booth, our staff will be available to answer various questions and address challenges related to products and safety measures on-site. We sincerely look forward to your visit.

Luminex Japan Co., Ltd. will exhibit at the 33rd Annual Meeting of the Japanese Society for Organ Transplantation, held at Nagasaki University from October 3 (Friday) to October 5 (Sunday). Please feel free to consult us at our booth regarding any questions about Luminex systems. We would also love to hear your feedback and requests!

[Speaker] Yuri Ishii, Deputy Director, Environmental Economics Division, Minister's Secretariat, Ministry of the Environment [Key Lecture Content] This guide has been created with the intention of assisting companies in responding to the increasing demands for disclosure in various environmental fields, such as climate change and natural capital, and was published in June of the 7th year of Reiwa. The "integrated approach" introduced in this guide suggests that companies should not respond individually to the disclosure requirements in each environmental field, but rather engage with an awareness of their interconnections. Through this initiative, we aim to improve business processes under management involvement, effectively and efficiently address various environmental issues, and facilitate disclosure. The key points of the guide will be explained. [Lecture Items] 1. Expansion of environmental issues to be addressed 2. Significance of integrated initiatives and disclosure 3. Trends in sustainability-related information disclosure 4. Methods and benefits of integrated initiatives and disclosure; case studies of companies 5. Utilization of environmental due diligence for information disclosure 6. Q&A / Business card exchange