We will exhibit at the 2nd Power Device & Module EXPO! (Thermal Management)
39th Nepcon Japan (2nd Power Device & Module EXPO)
We propose the vertically oriented high thermal conductivity TIM "Zebro."
【Dates】January 22 (Wednesday) - 24 (Friday), 2025
【Venue】Tokyo Big Sight, East Hall 7, Booth No.: E69-20
Please register as a visitor via the URL below and be sure to visit our booth!
Just apply pressure (surface pressure), and incredible thermal measures are here!
With high durability, there is no degradation of properties due to pump-out or dry-out phenomena.
It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material.
For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs.

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