We will exhibit at the 2nd Power Device & Module EXPO!

We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO).
We propose the vertically oriented high thermal conductivity TIM "Zebro."
Just applying pressure (surface pressure) brings astonishing thermal management!
It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material.
For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs.
We sincerely look forward to your visit!

Date and time | Wednesday, Jan 22, 2025 ~ Friday, Jan 24, 2025 10:00 AM ~ 05:00 PM |
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Capital | Tokyo Big Sight, East Hall 7, Booth Number: E69-20 |
Entry fee | Free Pre-registration system |
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