Restoration, redesign, and reverse engineering of discontinued products【JOHNAN DMS】

We contribute to extending the life of products and reducing waste through our substrate recycling business.

Our company offers a "PCB Reclamation Service" centered around home appliances, based on the technology and know-how cultivated through many years in the circuit board business. By providing services such as the replacement of faulty components and cleaning, we contribute to extending the life of products, reducing waste, and lowering environmental impact. For more details, please visit our website. "PCB Reclamation Service for Home Appliances" https://www.johnan.com/dms/mounting/pcb/ If you have any concerns regarding our PCB reclamation service for home appliances, please feel free to contact us. Through our manufacturing services, we will continue to contribute to solving various challenges for our customers.

• Calibration and repair

Supports ultra-small chip mounting on various substrate materials, as well as high-speed and multi-variety component mounting.

JOHNAN DMS Corporation contributes to the miniaturization and modularization of products through high-density mounting, such as 0201 implementation and minimum 0.1mm gap mounting. We support consistent manufacturing from substrate mounting to product assembly, inspection, and finished products, accommodating ultra-small chips. Target substrates: aluminum substrates, flexible substrates, high multilayer substrates, paper substrates, paper phenol, PET film, etc. For more detailed service information (supported substrates, types of solder, mounting capabilities), please visit our website. https://www.johnan.com/dms/mounting/pcb/ 【Contact Information】 TEL: 0774-43-1431 Website: https://www.johnan.com/dms/contact/

• Other electronic parts

0201 implementation contributes to manufacturing products for ultra-high-density mounting, module mounting, and embedded component substrates with a minimum gap of 0.1mm.

JOHNAN DMS Corporation contributes to our customers' manufacturing through product miniaturization and modularization. We provide a consistent system from product conceptual design to circuit board assembly, product assembly, and quality inspection. We can accommodate customer requests from implementation technology development to contract manufacturing. We also have a manufacturing base in Thailand and offer EMS services. ■ SMT Mounting Capability (Surface Mount Technology) 【Precision】 Reflow: chip 0201, chip 0402 Reflow & Flow (Bond Mounting): chip 0603 and above 【Supported Chips】 BGA, SOP, QFP, LED, QFN, etc. 【Supported Sizes】 Maximum size: 250mm × 330mm, board thickness: 0.5mm to 1.6mm (MAX: 5.0mm) ■ Chip Mounting 0201 chip mounting, 0201 mounting with a minimum gap of 0.1mm. High effectiveness is expected for ultra-high-density mounting, module mounting, and component-integrated circuit board mounting. ■ COB Mounting (Chip On Board) 【Mounting Capability】 0.2mm to 10mm Post-mounting of COB substrates. Cream solder application is possible using a dispenser. For more details, please refer to the related links.

• Circuit board design and manufacturing

Dear Sir/Madam, I would like to express my congratulations on the continued prosperity of your company. Thank you very much for your exceptional support. We would like to inform you that our company will be closed for winter holidays during the following period. We apologize for any inconvenience this may cause and kindly ask for your understanding. 1. Winter Holiday Period From Thursday, December 28, 2023, to Thursday, January 4, 2024. 2. Business Operations After the Winter Holiday Period We will resume normal operations from Friday, January 5, 2024.

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without any thermal impact on the base material. Repairs can be conducted in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is required, please contact us.