0201 implementation contributes to manufacturing products for ultra-high-density mounting, module mounting, and embedded component substrates with a minimum gap of 0.1mm.
JOHNAN DMS Corporation contributes to our customers' manufacturing through product miniaturization and modularization. We provide a consistent system from product conceptual design to circuit board assembly, product assembly, and quality inspection. We can accommodate customer requests from implementation technology development to contract manufacturing. We also have a manufacturing base in Thailand and offer EMS services. ■ SMT Mounting Capability (Surface Mount Technology) 【Precision】 Reflow: chip 0201, chip 0402 Reflow & Flow (Bond Mounting): chip 0603 and above 【Supported Chips】 BGA, SOP, QFP, LED, QFN, etc. 【Supported Sizes】 Maximum size: 250mm × 330mm, board thickness: 0.5mm to 1.6mm (MAX: 5.0mm) ■ Chip Mounting 0201 chip mounting, 0201 mounting with a minimum gap of 0.1mm. High effectiveness is expected for ultra-high-density mounting, module mounting, and component-integrated circuit board mounting. ■ COB Mounting (Chip On Board) 【Mounting Capability】 0.2mm to 10mm Post-mounting of COB substrates. Cream solder application is possible using a dispenser. For more details, please refer to the related links.
Inquire About This Product
basic information
For more details, please feel free to contact us by phone or through our website. 【Contact Information】 TEL: 0774-43-1431 Website: https://www.johnan.com/dms/contact/
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the related links or feel free to contact us. On-vehicle brake assist Display boards for railway vehicles Displays for sensors and mobile phones Display boards for medical devices Power boards for LED lighting, microwaves, rice cookers, etc.
News about this product（1）
Company information
"I don't know where to ask for help..." Our experienced staff will support the manufacturing of electronic components and devices. We provide a manufacturing support service that you can trust, with a consistent production system from design to implementation, assembly, and inspection of electronic components and devices. - Design contract support for new products - Alternative proposals for hard-to-obtain discontinued products (EOL) - Ultra-high-density mounting in 0201 size - Implementation on functional films, stretchable substrates, and paper substrates using bendable and stretchable materials With high-precision mounting technology, we respond to our customers' diverse needs. With years of accumulated experience and technical expertise, we support the manufacturing of high-quality and highly reliable products, creating new value for our customers' businesses. For inquiries regarding the design, manufacturing, or mounting technology of electronic components and devices, please feel free to consult us. Through collaboration with partner companies, we will provide optimal proposals to solve manufacturing challenges.