We will exhibit at "nano tech 2025."

This is a microparticle polymer based on polymerizable monomers such as styrene and methyl methacrylate, created from our unique suspension polymerization technology.

Techpolymers based on polymerizable monomers such as methyl methacrylate and styrene can be utilized in various applications, leveraging their properties for light diffusion in resin films and molded products, providing matte and scratch resistance in paints and inks, and enhancing slip properties in cosmetics. The main fields of application include displays, LED lighting, paints, cosmetics, and electronic materials. We are advancing material development with various customizations, including particle size (nano to micro), particle size distribution (polydisperse to monodisperse), particle shape (porous, irregular, hollow), refractive index, hardness, solvent resistance, heat resistance, and composite technology. If you have any issues with fine particles, please feel free to contact us. There are individual pages for various products, so please take a look at them as well.

• Other optical parts
• plastic

Fluorine-based resin dispersants (aqueous, alcohol-based) compliant with PFAS regulations.

Introducing "Fluxflow," a non-fluorinated dispersant utilizing biomimetic technology modeled after the adhesive structure of mussels (catechol structure). ◆ Product Concept - A polymer-type dispersant that adheres to PTFE using catechol-based adhesive functional groups. - An alternative to fluorinated dispersants that are restricted in specifications due to PFAS regulations. - The affinity with the dispersing medium can be controlled by adjusting the polymer structure.

• Chemicals

Nano-sized organic resin particles that possess an air layer, allowing for the impartation of various properties (low refractive index, low dielectric constant, lightweight, thermal insulation).

These are organic resin microparticles with a particle diameter in the nanoscale and a hollow interior. They are provided in a solvent dispersion to achieve primary dispersion of the nanoscale particles. 〇 Features (1) The particle diameter is nanoscale, and the particle size distribution is uniform, allowing for the creation of a highly transparent low refractive index film when added to materials. (2) Being polymer microparticles, they have good compatibility with resin materials and organic solvents, resulting in excellent dispersibility. (3) Compared to inorganic hollow particles, the organic NH series has a lighter weight per particle, leading to a higher number of particles when added in the same weight, resulting in enhanced properties. (4) They have high affinity with the coating film, making it less likely for cracks to occur during film bending or punching processes. (5) The hollow structure allows for expected properties such as weight reduction, thermal insulation, and low dielectric constant in addition to lowering the refractive index. 〇 Comparison of reflections due to low-reflection films By adding to the coating film, the refractive index decreases, reducing light reflection. 〇 Comparison of coating film strength during film bending Since TP-NH is a resin composition, it has high compliance with organic binders, resulting in a coating film with excellent bend resistance.

• plastic

Due to the presence of an air layer, it is possible to impart various properties (low refractive index, low dielectric constant, lightweight, thermal insulation). Available in sizes ranging from nano to micron.

It is a polymer microparticle with an air layer inside. By adding it to materials, it can impart properties of air, such as low refraction (low reflection) and low dielectric characteristics. Additionally, when added to resin, a hollow structure can also provide stress relaxation effects. The particle size can be provided in nano to micro sizes according to your requirements. *Please refer to the catalog available for download below for SEM images, features, and dielectric data.

• Other electronic parts
• Other optical parts
• plastic

"Tech Polymer" is proposing solutions for low dielectric applications that reduce transmission loss in the high-frequency range.

We would like to introduce our development products aimed at the development of low-dielectric semiconductors and substrates that can suppress signal transmission loss in the high-frequency range required for the next-generation mobile communication system, 5G, which enables high-speed communication of large-capacity data. 【Product Overview】 Particle Structure: Solid Type Particle Structure: Hollow Type For information on particle size, particle size distribution, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation. 【Customization Examples】 Particle Size Adjustment Particle Surface Modification (Dispersion Improvement) 【Application Examples】 Additives for materials in semiconductor packaging and mounting fields.

• plastic

The polymer microparticle "Techpolymer" has the characteristic of thermal decomposition and can be used as a pore-forming material.

The polymer microparticle "Tech Polymer" has the characteristic of thermal decomposition and can be used as a pore-forming material. It is primarily mixed with ceramic powders or metal powders, and during firing, the particles burn away, creating spherical pores. Additionally, a significant feature of "Tech Polymer" is that it produces very little residue after decomposition. 【Features】 ■ Particle Size, Particle Size Distribution, and Shape We offer a wide range of particle sizes from submicron to micron. It is also possible to achieve a sharp particle size distribution, contributing to uniform pore formation. In addition to the main spherical microparticles, we also have irregularly shaped particles such as biconvex lens-shaped and hemispherical particles, making it suitable for forming special pores. ■ Low Residue Tech Polymer has minimal residue after decomposition. ■ Environmental Consideration By using hollow microparticles and low-temperature thermal decomposition microparticles, we can propose products that contribute to energy reduction, and by using biomass particles, we can help reduce carbon emissions, thus promoting environmental consideration.

• plastic

We will be exhibiting at the "Kyushu Printing Information Industry Exhibition 2026" held at the Fukuoka International Center. During the event, we will showcase various products. We invite all related parties to come together and visit us. 【Suppliers】 ・Laser-X

This year, Toyota Kikan will exhibit at the Toyota Business Fair. We will introduce products that are useful for heatstroke prevention and more. Our top recommendation is SPACECOOL. Please feel free to visit our booth! SPACECOOL is an "eco-friendly cooling solution" essential for the future of our planet's environment! Be sure to check it out. Also, take a look at the basic knowledge for heat prevention in factories moving forward.

In the operation of drawings, do you face challenges such as "taking too long to find," "uncertainty about whether it's the latest version," or "high likelihood of confirmation errors"? By utilizing CADSUPER's barcode function (optional), you can reliably connect drawings and information, allowing for a smooth advancement of DX in drawing utilization. In this seminar, we will introduce how using barcodes can change: - Drawing management and search - Confirmation and cross-checking tasks - Information collaboration with the field This content is recommended not only for existing users but also for those considering improving the efficiency of drawing operations and reducing errors.

Daitō Shikō Co., Ltd. will be exhibiting at the "International Fire and Disaster Prevention Exhibition" held at Shirakawa Park in Nagoya City, Aichi Prefecture, from Thursday, May 28, 2026. At the exhibition venue, we plan to showcase goods that are perfect for fire prevention events and recruitment activities for members. If you are looking for SP tools, promotional items, or novelties, please be sure to visit our booth.

[Speaker] Miho Ko Shimada, Partner Attorney, Mori Hamada & Matsumoto Law Firm, Foreign Law Joint Enterprise [Key Lecture Content] The movement towards the implementation of CCS, which is positioned as an essential technology for decarbonizing hard-to-abate industries, is gaining momentum in Japan. Among the "advanced CCS projects" selected for business commencement in the early 2030s, some pipeline projects have progressed to the exploratory drilling stage. For shipping transport projects, discussions are underway to create mechanisms for clustering CO2 sources and improving shipping transport efficiency. In this seminar, following the full enforcement of the CCS Business Act on May 22, we will organize the current state of the business environment related to CCS and examine the latest discussions at the Agency for Natural Resources and Energy and the Ministry of the Environment (based on information available at the time of the event) from a legal perspective as we consider the shape of CCS projects leading to Final Investment Decision (FID). [Lecture Items] 1. Current state of the business environment related to CCS 2. Overview of the CCS Business Act 3. Overview of the cost difference support system for CCS projects (pipelines) 4. Structural considerations through the CCS value chain 5. Q&A / Business card exchange