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  3. 積水化成品工業
  4. We will exhibit at "nano tech 2025."
SEMINAR_EVENT
  • Jan 07, 2025
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Jan 07, 2025

We will exhibit at "nano tech 2025."

積水化成品工業 積水化成品工業
Our company will exhibit at "nano tech 2025 - The 24th International Nanotechnology Exhibition and Conference" held at Tokyo Big Sight from January 29 to 31, 2025, as well as at the online exhibition. We will showcase the following products from our brand at one of the world's largest exhibitions gathering nanotechnology technologies from both domestic and international sources. 【Main Exhibits from Our Company】 ◆ Tech Polymer (Polymer Microparticles) ◆ Fluxflow (Polymer Materials Using Solution Polymerization)
Date and time Wednesday, Jan 29, 2025 ~ Friday, Jan 31, 2025
10:00 AM ~ 05:00 PM
Capital Tokyo Big Sight, East Exhibition Hall 1-6, Materials and Materials: Nanomaterials Zone, Booth Number: 4K-13
Entry fee Free
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Introduction to polymer microparticles (tech polymers)

This is a microparticle polymer based on polymerizable monomers such as styrene and methyl methacrylate, created from our unique suspension polymerization technology.

Techpolymers based on polymerizable monomers such as methyl methacrylate and styrene can be utilized in various applications, leveraging their properties for light diffusion in resin films and molded products, providing matte and scratch resistance in paints and inks, and enhancing slip properties in cosmetics. The main fields of application include displays, LED lighting, paints, cosmetics, and electronic materials. We are advancing material development with various customizations, including particle size (nano to micro), particle size distribution (polydisperse to monodisperse), particle shape (porous, irregular, hollow), refractive index, hardness, solvent resistance, heat resistance, and composite technology. If you have any issues with fine particles, please feel free to contact us. There are individual pages for various products, so please take a look at them as well.

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Non-fluorinated dispersant

Fluorine-based resin dispersants (aqueous, alcohol-based) compliant with PFAS regulations.

Introducing "Fluxflow," a non-fluorinated dispersant utilizing biomimetic technology modeled after the adhesive structure of mussels (catechol structure). ◆ Product Concept - A polymer-type dispersant that adheres to PTFE using catechol-based adhesive functional groups. - An alternative to fluorinated dispersants that are restricted in specifications due to PFAS regulations. - The affinity with the dispersing medium can be controlled by adjusting the polymer structure.

  • Chemicals

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Hollow nanoacrylic particles solvent dispersion transparent low refractive index and low dielectric properties.

Nano-sized organic resin particles that possess an air layer, allowing for the impartation of various properties (low refractive index, low dielectric constant, lightweight, thermal insulation).

These are organic resin microparticles with a particle diameter in the nanoscale and a hollow interior. They are provided in a solvent dispersion to achieve primary dispersion of the nanoscale particles. 〇 Features (1) The particle diameter is nanoscale, and the particle size distribution is uniform, allowing for the creation of a highly transparent low refractive index film when added to materials. (2) Being polymer microparticles, they have good compatibility with resin materials and organic solvents, resulting in excellent dispersibility. (3) Compared to inorganic hollow particles, the organic NH series has a lighter weight per particle, leading to a higher number of particles when added in the same weight, resulting in enhanced properties. (4) They have high affinity with the coating film, making it less likely for cracks to occur during film bending or punching processes. (5) The hollow structure allows for expected properties such as weight reduction, thermal insulation, and low dielectric constant in addition to lowering the refractive index. 〇 Comparison of reflections due to low-reflection films By adding to the coating film, the refractive index decreases, reducing light reflection. 〇 Comparison of coating film strength during film bending Since TP-NH is a resin composition, it has high compliance with organic binders, resulting in a coating film with excellent bend resistance.

  • plastic

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Hollow polymer particles with low refractive index, low dielectric constant, lightweight, and thermal insulation.

Due to the presence of an air layer, it is possible to impart various properties (low refractive index, low dielectric constant, lightweight, thermal insulation). Available in sizes ranging from nano to micron.

It is a polymer microparticle with an air layer inside. By adding it to materials, it can impart properties of air, such as low refraction (low reflection) and low dielectric characteristics. Additionally, when added to resin, a hollow structure can also provide stress relaxation effects. The particle size can be provided in nano to micro sizes according to your requirements. *Please refer to the catalog available for download below for SEM images, features, and dielectric data.

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  • Other optical parts
  • plastic

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Polymer microparticles for low dielectric applications in the field of electronic materials

"Tech Polymer" is proposing solutions for low dielectric applications that reduce transmission loss in the high-frequency range.

We would like to introduce our development products aimed at the development of low-dielectric semiconductors and substrates that can suppress signal transmission loss in the high-frequency range required for the next-generation mobile communication system, 5G, which enables high-speed communication of large-capacity data. 【Product Overview】 Particle Structure: Solid Type Particle Structure: Hollow Type For information on particle size, particle size distribution, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation. 【Customization Examples】 Particle Size Adjustment Particle Surface Modification (Dispersion Improvement) 【Application Examples】 Additives for materials in semiconductor packaging and mounting fields.

  • plastic

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Polymer microparticles for drilling applications

The polymer microparticle "Techpolymer" has the characteristic of thermal decomposition and can be used as a pore-forming material.

The polymer microparticle "Tech Polymer" has the characteristic of thermal decomposition and can be used as a pore-forming material. It is primarily mixed with ceramic powders or metal powders, and during firing, the particles burn away, creating spherical pores. Additionally, a significant feature of "Tech Polymer" is that it produces very little residue after decomposition. 【Features】 ■ Particle Size, Particle Size Distribution, and Shape We offer a wide range of particle sizes from submicron to micron. It is also possible to achieve a sharp particle size distribution, contributing to uniform pore formation. In addition to the main spherical microparticles, we also have irregularly shaped particles such as biconvex lens-shaped and hemispherical particles, making it suitable for forming special pores. ■ Low Residue Tech Polymer has minimal residue after decomposition. ■ Environmental Consideration By using hollow microparticles and low-temperature thermal decomposition microparticles, we can propose products that contribute to energy reduction, and by using biomass particles, we can help reduce carbon emissions, thus promoting environmental consideration.

  • plastic

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Related catalog(6)

About Tech Polymer

About Tech Polymer

CATALOG
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Non-fluorinated dispersant

Non-fluorinated dispersant

PRODUCT
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  • Catalog download

Contact this catalog

Hollow nanoacrylic particles solvent dispersion transparent low refractive index and low dielectric properties.

Hollow nanoacrylic particles solvent dispersion transparent low refractive index and low dielectric properties.

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Hollow polymer particles with low refractive index, low dielectric constant, lightweight, and thermal insulation.

Hollow polymer particles with low refractive index, low dielectric constant, lightweight, and thermal insulation.

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Electronic materials field: Polymer microparticles for low dielectric applications

Electronic materials field: Polymer microparticles for low dielectric applications

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Polymer microparticles for drilling applications

Polymer microparticles for drilling applications

PRODUCT
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  • Catalog download

Contact this catalog

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積水化成品工業
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Notice of Participation in the 8th Coating Japan Paint and Coating Equipment Exhibition from November 12 (Wednesday) to November 14 (Friday), 2025.

  • NEW
  • SEMINAR_EVENT

Our company will be exhibiting at the "16th Advanced Functional Materials Week Tokyo" held at Makuhari Messe, specifically at the "8th Coating Japan: Paints and Coating Equipment Exhibition." This exhibition is a specialized event where functional paints, coating equipment, surface treatment technologies, and more will be showcased all in one place. A wide range of engineers from industrial fields such as electronics and automotive to architecture and building materials will be in attendance. At this exhibition, you can discover new products and technologies, consult directly with engineers, discuss estimates and implementation timelines, and learn about industry trends. We sincerely look forward to your visit.

Oct 21, 2025

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Accelerating Material Development DX! We will exhibit at the High-Performance Materials Week Tokyo from November 12 to 14.

  • NEW
  • SEMINAR_EVENT

■Accelerating Next-Generation Polymer Design: Digital Chemistry Platform■ With the evolution of molecular simulation technology, we have entered an era where phenomena at the atomic and molecular levels can be reproduced and analyzed on computers. Furthermore, by combining this with machine learning, it has become possible to achieve high-precision material predictions and designs even with limited experimental data. Schrödinger strongly supports the enhancement of your analytical capabilities and the efficiency of research and development through cutting-edge molecular simulation and AI/ML technologies, as well as our unique digital platform that integrates these technologies. At this exhibition booth, our specialized staff will clearly introduce an overview of these technologies and case studies, and will also answer any questions you may have. *During the exhibition, we will hold a seminar at our booth. Location: Our exhibition booth Theme: Accelerating Next-Generation Polymer Material Development with Machine Learning and Atomic-Level Simulation 【Exhibition Information】 Exhibition Name: 14th High-Performance Plastics Exhibition within High-Functionality Materials Week Dates: November 12 (Wednesday) to 14 (Friday), 2025, 10:00 AM to 6:00 PM (ends at 5:00 PM on the last day) Venue: Makuhari Messe Halls 1-3 Booth Number: 15-10

Oct 21, 2025

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We will exhibit at Automotive World from October 29 to 31, 2025, at Port Messe Nagoya.

  • NEW
  • SEMINAR_EVENT

We will showcase flexible busbars that can also be used in vehicles. Additionally, we will display various power supplies for precision welding machines, as well as automatic machines and processing electrodes.

Oct 21, 2025

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On October 24 (Friday) at 11:00, our company’s Kiuchi will be speaking at the "Latest Technology Session by NVIDIA Partners" during the 2025 Japan IT Week [Autumn]!

  • NEW
  • SEMINAR_EVENT

NVIDIA, a partner company of ADLINK Japan, will hold the "Latest Technology Session by NVIDIA Partners" at the 2025 Japan IT Week [Autumn], where ADLINK Japan's Kiuchi will present on the theme "Introduction to Embedded AI Solutions for TCO Reduction." This is an open seminar that is free and does not require prior registration, so please join us.

Oct 21, 2025

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Notice of Participation in EdgeTech+2025

  • NEW
  • SEMINAR_EVENT

This exhibition is one of the largest comprehensive exhibitions for embedded and edge technology in Japan, focusing on design philosophy based on AI, secure by design, and building resilient supply chains. It provides an overview of the entire embedded ecosystem, covering everything from institutional and market trends to on-site implementation, allowing attendees to experience the forefront of transformation in embedded technology. At the D-Link booth, we will introduce our "4G/5G M2M products," which can be widely used from offices and stores to embedded devices, factory equipment, and in-vehicle systems, along with the cloud management platform "D-ECS" that streamlines operations after implementation. We will also showcase the "DIS series," an industrial switch with excellent durability, featuring a wide operating temperature range from -40°C to 75°C and compliance with IP protection ratings.

Oct 21, 2025

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