We will exhibit at "nano tech 2025."

This is a microparticle polymer based on polymerizable monomers such as styrene and methyl methacrylate, created from our unique suspension polymerization technology.

Techpolymers based on polymerizable monomers such as methyl methacrylate and styrene can be utilized in various applications, leveraging their properties for light diffusion in resin films and molded products, providing matte and scratch resistance in paints and inks, and enhancing slip properties in cosmetics. The main fields of application include displays, LED lighting, paints, cosmetics, and electronic materials. We are advancing material development with various customizations, including particle size (nano to micro), particle size distribution (polydisperse to monodisperse), particle shape (porous, irregular, hollow), refractive index, hardness, solvent resistance, heat resistance, and composite technology. If you have any issues with fine particles, please feel free to contact us. There are individual pages for various products, so please take a look at them as well.

• Other optical parts
• plastic

Fluorine-based resin dispersants (aqueous, alcohol-based) compliant with PFAS regulations.

Introducing "Fluxflow," a non-fluorinated dispersant utilizing biomimetic technology modeled after the adhesive structure of mussels (catechol structure). ◆ Product Concept - A polymer-type dispersant that adheres to PTFE using catechol-based adhesive functional groups. - An alternative to fluorinated dispersants that are restricted in specifications due to PFAS regulations. - The affinity with the dispersing medium can be controlled by adjusting the polymer structure.

• Chemicals

Nano-sized organic resin particles that possess an air layer, allowing for the impartation of various properties (low refractive index, low dielectric constant, lightweight, thermal insulation).

These are organic resin microparticles with a particle diameter in the nanoscale and a hollow interior. They are provided in a solvent dispersion to achieve primary dispersion of the nanoscale particles. 〇 Features (1) The particle diameter is nanoscale, and the particle size distribution is uniform, allowing for the creation of a highly transparent low refractive index film when added to materials. (2) Being polymer microparticles, they have good compatibility with resin materials and organic solvents, resulting in excellent dispersibility. (3) Compared to inorganic hollow particles, the organic NH series has a lighter weight per particle, leading to a higher number of particles when added in the same weight, resulting in enhanced properties. (4) They have high affinity with the coating film, making it less likely for cracks to occur during film bending or punching processes. (5) The hollow structure allows for expected properties such as weight reduction, thermal insulation, and low dielectric constant in addition to lowering the refractive index. 〇 Comparison of reflections due to low-reflection films By adding to the coating film, the refractive index decreases, reducing light reflection. 〇 Comparison of coating film strength during film bending Since TP-NH is a resin composition, it has high compliance with organic binders, resulting in a coating film with excellent bend resistance.

• plastic

Due to the presence of an air layer, it is possible to impart various properties (low refractive index, low dielectric constant, lightweight, thermal insulation). Available in sizes ranging from nano to micron.

It is a polymer microparticle with an air layer inside. By adding it to materials, it can impart properties of air, such as low refraction (low reflection) and low dielectric characteristics. Additionally, when added to resin, a hollow structure can also provide stress relaxation effects. The particle size can be provided in nano to micro sizes according to your requirements. *Please refer to the catalog available for download below for SEM images, features, and dielectric data.

• Other electronic parts
• Other optical parts
• plastic

"Tech Polymer" is proposing solutions for low dielectric applications that reduce transmission loss in the high-frequency range.

We would like to introduce our development products aimed at the development of low-dielectric semiconductors and substrates that can suppress signal transmission loss in the high-frequency range required for the next-generation mobile communication system, 5G, which enables high-speed communication of large-capacity data. 【Product Overview】 Particle Structure: Solid Type Particle Structure: Hollow Type For information on particle size, particle size distribution, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation. 【Customization Examples】 Particle Size Adjustment Particle Surface Modification (Dispersion Improvement) 【Application Examples】 Additives for materials in semiconductor packaging and mounting fields.

• plastic

The polymer microparticle "Techpolymer" has the characteristic of thermal decomposition and can be used as a pore-forming material.

The polymer microparticle "Tech Polymer" has the characteristic of thermal decomposition and can be used as a pore-forming material. It is primarily mixed with ceramic powders or metal powders, and during firing, the particles burn away, creating spherical pores. Additionally, a significant feature of "Tech Polymer" is that it produces very little residue after decomposition. 【Features】 ■ Particle Size, Particle Size Distribution, and Shape We offer a wide range of particle sizes from submicron to micron. It is also possible to achieve a sharp particle size distribution, contributing to uniform pore formation. In addition to the main spherical microparticles, we also have irregularly shaped particles such as biconvex lens-shaped and hemispherical particles, making it suitable for forming special pores. ■ Low Residue Tech Polymer has minimal residue after decomposition. ■ Environmental Consideration By using hollow microparticles and low-temperature thermal decomposition microparticles, we can propose products that contribute to energy reduction, and by using biomass particles, we can help reduce carbon emissions, thus promoting environmental consideration.

• plastic

In recent years, the implementation of maintenance DX to achieve "non-stop factories" has become an urgent necessity in manufacturing sites. Amid the trend of factory IoT and data utilization, the use of remote I/O, which can remotely aggregate and collect sensor information and control signals from equipment and sensors dispersed inside and outside the factory, is gaining importance as a foundation for predictive maintenance and condition monitoring. On the other hand, the installation environment for remote I/O is not necessarily limited to control panels or well-conditioned factory interiors. There is an increasing need to collect data in harsh environments, such as outdoor equipment and conditions involving high temperatures, low temperatures, vibrations, and strong electrical noise. Conventional remote I/O systems have struggled to operate stably under such conditions, requiring measures like installation location constraints and additional protective enclosures. Environmentally robust remote I/O with wide temperature support and noise resistance can address these challenges, enabling the expansion of the scope of factory IoT and predictive maintenance to outdoor and remote equipment. In this seminar, we will introduce the lineup of Contec's environmentally robust remote I/O, the "CONPROSYS(R) Robust I/O Series," which includes a total of 23 products.

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Takaya Corporation will exhibit at the 27th Automatic Identification Comprehensive Exhibition, showcasing the latest RFID solution, "Visible RFID." Exhibition Details: ■ RFID Work Performance Collection System No need for a control PC or dedicated software Autonomous reader compatible with HF and UHF bands Cloud transmission with just an internet connection "Visualization" of work performance on a dashboard Integration with BI tools for "visualization of location" is also possible. ■ Newly developed "Visible RFID" autonomous reader Equipped with an LCD touch panel for on-site performance verification Efficient data management with batch transmission Experience the operability through live demonstrations We will also showcase various other products. Please visit the Takaya booth to experience the latest RFID solutions! We look forward to your visit.

[Lecture Topics] 1. Latest Trends in Information and Communication Policy of the Ministry of Internal Affairs and Communications Kei Yano, Deputy Director, Information and Communications Policy Division, Information and Communications Bureau, Ministry of Internal Affairs and Communications 2. Semiconductor and Digital Policies of the Ministry of Economy, Trade and Industry Tomonari Fujishiro, Chief of the General Affairs Section, Commerce and Information Policy Bureau, Ministry of Economy, Trade and Industry / Chief of the Minister's Secretariat 3. DX Vision of the Ministry of Land, Infrastructure, Transport and Tourism Taisuke Okubo, IT Strategy Planning and Coordination Officer, Information Policy Division, Comprehensive Policy Bureau, Ministry of Land, Infrastructure, Transport and Tourism

[Speaker] Mr. Hideo Sugiura, President and CEO of RSI Co., Ltd. [Key Lecture Content] This seminar will provide a clear explanation of data centers, which are becoming increasingly important as a foundation supporting society and economic activities, from the basics. It will organize the roles of data centers and their fundamental business models, illustrating the background of market expansion and the rising demand. Additionally, it will overview the conditions required for location and buildings, as well as the characteristics of the business, highlighting perspectives that differ from conventional real estate. Furthermore, it will address the latest trends such as the proliferation of AI and the introduction of renewable energy, exploring new entry opportunities and future possibilities across various fields. [Lecture Items] 1. What is a Data Center? - The true nature of the "information infrastructure" that supports society 2. Global and Japanese Market Environment - Trends in rapidly expanding demand and investment 3. Business Models of the Industry - From hyperscalers to colocation 4. Location Conditions and Equipment Requirements - From the perspectives of power, communication, cooling, and security 5. Challenges in the Age of AI - Power, cooling, cost, and carbon-free responses 6. Future Outlook - The future of next-generation digital infrastructure and decentralized data centers 7. Q&A / Business Card Exchange