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  6. Polymer microparticles for low dielectric applications in the field of electronic materials

Polymer microparticles for low dielectric applications in the field of electronic materials

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Tech Polymer

last updated:Feb 04, 2025

積水化成品工業
積水化成品工業
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"Tech Polymer" is proposing solutions for low dielectric applications that reduce transmission loss in the high-frequency range.

We would like to introduce our development products aimed at the development of low-dielectric semiconductors and substrates that can suppress signal transmission loss in the high-frequency range required for the next-generation mobile communication system, 5G, which enables high-speed communication of large-capacity data. 【Product Overview】 Particle Structure: Solid Type Particle Structure: Hollow Type For information on particle size, particle size distribution, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation. 【Customization Examples】 Particle Size Adjustment Particle Surface Modification (Dispersion Improvement) 【Application Examples】 Additives for materials in semiconductor packaging and mounting fields.

    plastic
多分散粒子リサイズ.png

Polymer microparticles for low dielectric applications in the field of electronic materials

多分散粒子リサイズ.png
多分散粒子リサイズ.png
  • Product HP【Tech Polymer】
  • Special site - Product/service details - https://pr.mono.ipros.com/tech-p/product/

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Electronic Materials Field: Polymer Microparticles for Low Dielectric Applications (Tech Polymer) Tech Polymer has begun proposals for low dielectric applications aimed at reducing transmission loss in high-frequency domains. We are conducting product proposals leveraging high customization capabilities, so please feel free to contact us if you are interested. For more details, please inquire through the Ipros link or our company website. (If you are contacting us via our website, please mention that you have seen the product page on Ipros.) Our website: https://www.tech-p.com/ 【Related Keywords】Organic Microparticles / Polymer Microparticles / Micronized Powders / Beads / Fillers / Powders / Dielectric Constant / Dielectric Loss Tangent / Substrates / Copper-Clad Laminates

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Applications/Examples of results

【Examples of Applicable Fields】 - Semiconductor packages - Mounting fields - Substrates - Copper-clad laminates, etc. 【Functionality Enhancement】 - Low dielectric - Flexibility, etc.

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Electronic materials field: Polymer microparticles for low dielectric applications

Electronic materials field: Polymer microparticles for low dielectric applications

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Hollow polymer particles with low refractive index, low dielectric constant, lightweight, and thermal insulation.

Hollow polymer particles with low refractive index, low dielectric constant, lightweight, and thermal insulation.

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Hollow nanoacrylic particles solvent dispersion transparent low refractive index and low dielectric properties.

Hollow nanoacrylic particles solvent dispersion transparent low refractive index and low dielectric properties.

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We will exhibit at "nano tech 2025."

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Our company will exhibit at "nano tech 2025 - The 24th International Nanotechnology Exhibition and Conference" held at Tokyo Big Sight from January 29 to 31, 2025, as well as at the online exhibition. We will showcase the following products from our brand at one of the world's largest exhibitions gathering nanotechnology technologies from both domestic and international sources. 【Main Exhibits from Our Company】 ◆ Tech Polymer (Polymer Microparticles) ◆ Fluxflow (Polymer Materials Using Solution Polymerization)

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Publication of case studies on tech polymers! Announcement of catalog updates for polymer microparticles for low dielectric applications in the electronic materials field.

  • Catalog news

〇●〇 The catalog for Tech Polymer's "Polymer Microparticles for Low Dielectric Applications in the Electronic Materials Field" has been updated!! 〇●〇 We introduce our developed products aimed at the development of low dielectric semiconductors and substrates that suppress signal transmission loss in the high-frequency range required for the next-generation mobile communication system, 5G, which can transmit large volumes of data at high speeds. 【Product Overview】 Particle Structure: Solid Type Particle Structure: Hollow Type For information on particle size, particle size distribution, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation.

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Publication of case studies on tech polymers! Announcement of catalog update for polymer microparticles for low dielectric applications in the electronic materials field.

  • Catalog news

〇●〇 The catalog for Tech Polymer's "Polymer Microparticles for Low Dielectric Applications in the Electronic Materials Field" has been updated!! 〇●〇 We are introducing development products aimed at the development of low dielectric semiconductors and substrates that suppress signal transmission loss in the high-frequency range required for the next-generation mobile communication system, 5G, which can communicate large volumes of data at high speeds. 【Product Overview】 Particle Structure: Solid Type Particle Structure: Hollow Type For information on particle size, particle size distribution, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation.

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積水化成品工業

積水化成品工業

Chemical

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Sekisui Chemical Co., Ltd. handles functional polymers (fine particles). We propose a unique solution by combining multiple functions and technologies. Additionally, our proprietary polymerization technology has developed tech polymers that come in a wide variety of grades to meet diverse needs. Customization of fine particles is possible according to your requirements. We can adjust particle size, particle size distribution, solvent resistance, heat resistance, refractive index, and more, so please feel free to contact us. <Our website has been renewed>

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