Notice of Participation in the 39th Internepcon Japan

With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!

The transition from CCD to CMOS has accelerated the trend towards higher resolution, and the fps continues to increase, resulting in greater power consumption (and heat generation) of cameras. As a result, concerns about inspection accuracy due to thermal effects on lenses have increased, and the impact on objects and peripheral devices can no longer be ignored. At Japan Bopixel, we have successfully utilized "Ultra Low Power FPGA," which can reduce power consumption by over 50% compared to comparable FPGAs, instead of the FPGAs commonly adopted by most camera manufacturers, which are the main source of heat generation in industrial cameras. By fundamentally suppressing heat generation, we can significantly reduce the power consumption and heat of the camera, allowing us to solve thermal issues with a new approach that leverages the advantages of being a latecomer in the market. *For more details, please download the catalog or feel free to contact us.*

• Visual Inspection Equipment
• Monochrome camera
• Technical and Reference Books

Achieving low power consumption and low heat generation with the incorporation of next-generation key devices.

A series of line scan cameras developed for high-speed image transmission in machine vision applications, using 75Ω coaxial cables, featuring the digital interface "CoaXPress." Centered around high-speed, high-resolution sensors, this series offers a powerful lineup that is ideal for stably capturing high-pixel, high-line-rate images while extending cable lengths. The camera housing is also equipped with mounting taps to accommodate various installation positions and conditions. Thanks to next-generation key devices that provide low power consumption and low heat generation, along with a highly reliable design boasting excellent heat dissipation, the power consumption is lower compared to similar products with the same sensor and interface from other manufacturers. Despite its compact housing size, it can be used without additional heat dissipation items. *For product specifications, please download the catalog. *We also offer demo units for loan, so feel free to contact us.

• Color camera
• Monochrome camera
• High Speed Camera

Achieving the industry's smallest class of chassis size: "CoaXPress" area scan camera series.

A series of area scan cameras developed for high-speed image transmission in machine vision applications using 75Ω coaxial cables. These cameras are ideal for situations where you want to extend cable length while reliably capturing high-resolution and high-frame-rate images. They are equipped with mounting taps on the camera housing, allowing for use in various installation positions and conditions. A diverse lineup is available, ranging from 0.5MP to a maximum of 65MP, with models that allow you to choose the connector output direction from the back (straight model) or the top (angle model). By adopting an Ultra Low Power FPGA, these cameras boast low power consumption, low heat generation, and high thermal dissipation reliability. Compared to other products with the same sensor and interface, they consume less power and achieve a compact body size that is among the smallest in the industry, allowing for use without additional heat dissipation items. *Please download the catalog for product specifications. *We also offer demo units for loan, so feel free to contact us.

• Monochrome camera

Industrial DLP projector that enables high-precision 3D inspection.

This is an industrial DLP projector suitable for solutions that require high-speed and high-precision 3D inspection, targeting applications such as 3D measurement, appearance inspection, and medical image processing. With a compact size that is easy to integrate, you can choose from a wide range of models, including Full HD and RGB models, C-mount specifications, and optical design types optimized for angled projection. It supports extensive and high-precision projection as well as high-speed inspection, ensuring minimal thermal deformation and high-quality projection effects through sophisticated optical and structural design.

• Other image-related equipment

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)