We will be exhibiting at the Total Solution Exhibition for Electronic Devices 2025, held from June 4 to June 6.

We propose solutions for thermal management issues such as warping of advanced semiconductor packages and mounting substrates, which have become challenges with the spread of AI and autonomous driving.
Venue: Tokyo Big Sight, East Hall 7
Booth Number: 7F-11
Exhibit Content:
- Thermal deformation measurement system and contract analysis services (panel display)
- Thermal image analysis system and contract analysis services (panel display)
- Tabletop windless constant temperature chamber (live demonstration)
- Spot cooling and heating device (panel display)

Date and time | Wednesday, Jun 04, 2025 ~ Friday, Jun 06, 2025 10:00 AM ~ 05:00 PM |
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Capital | Tokyo Big Sight |
Entry fee | Charge Admission fee: 1,000 yen. *If you register in advance for your visit, the admission fee will be free. |
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