We exhibited at the 2nd Power Device & Module Expo!

From January 22 to 24, 2025, we exhibited at the "Nepcon Japan Power Device & Module EXPO" held at Tokyo Big Sight. At this exhibition, we introduced our vertically oriented high thermal conductivity TIM, "Zebro," focusing on its features.
Zebro is a highly durable material that does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for long periods while maintaining a stable low thermal resistance, making it a reliable heat dissipation material.
With the increase in heat generation due to improved semiconductor performance and the miniaturization of devices, the efficiency of thermal management has become a significant challenge. Zebro can be utilized in applications that efficiently dissipate and cool heat generated by electronic components such as power semiconductors supplying high current and high voltage, as well as high-brightness and high-output LEDs/LDs.
For those seeking TIMs with good thermal conductivity or facing challenges with insufficient cooling from conventional heat dissipation materials, we offer a variety of thermal management solutions tailored to meet your needs, in addition to Zebro.
If you are interested, please feel free to contact us.


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