[Press Release] The metal plating chemicals market in 2025 is projected to grow by 9% year-on-year, reaching 1.06 billion USD - Announcement by Techcet.

According to a press release published by Techcet, a company specializing in research reports focused on semiconductor materials and supply chain composition, on January 23, 2025, the metal plating chemicals market is projected to reach $1.06 billion in 2025, an increase of 9% compared to the previous year.
Excerpt from the January 23, 2025 press release:
Metal plating chemicals on a growth trajectory, with copper leading
TECHCET, an electronic materials advisory company providing semiconductor materials supply chain information, forecasts that metal plating chemicals will reach $1.06 billion in 2025, a 9% increase compared to 2024. The largest segments are Cu plating chemicals used for device-level interconnections and SnAg/Sn used for package-level interconnections.
Lita Shon-Roy, CEO of TECHCET, stated, "The compound annual growth rate for advanced packaging materials is expected to be 8% until 2028, while Cu for device interconnection materials is projected to grow at 4.5%, and this growth is expected to continue in the coming years."
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