Measurement of Load in Metal Processing - Development of a Compact X-ray Device by Pulse Tech - Published in the Shizuoka Edition of the Nihon Keizai Shimbun on May 12, 2012.

On the 11th, Pulsatech Industries announced the development of a compact X-ray device that measures the load applied when bending materials such as iron. The device has been streamlined for portability, making it easy to use in outdoor settings or factory workspaces. It will be marketed to processing companies, including parts manufacturers, for product quality inspections and regular inspections of installations. The price, including the power supply, ranges from 7 to 8 million yen, with a goal of selling 30 units in the first year.
The developed device measures stress, which refers to the load that remains in the metal during processing. Weighing 3.5 kilograms, it measures stress by positioning it close to iron and measuring the angle of X-ray reflection. Sales will begin on June 1.
When bent metal is used for an extended period, the balance of stress can be disrupted due to surface wear and tear, leading to cracks and other issues. Therefore, it is necessary to adjust the stress or replace parts. Previously, measurements were cumbersome as they required large equipment.

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