September Course ★ [In-Person] KISTEC Educational Course "Research Trends and Challenges in Semiconductor Chiplet Integration and Hybrid Bonding Technology"

Amid the explosive growth in AI demand, there is a strong need for high efficiency and energy-saving data processing in semiconductors. The most anticipated breakthrough technology in this area is "chiplets," with the "hybrid bonding" technology that enables ultra-high-density wiring positioned as a key technology. This lecture, led by a prominent researcher at the forefront of hybrid bonding technology research, will provide a comprehensive three-hour course.
<Date> September 5, 2025 (Friday) 13:00-17:00
<Instructor> Fumitaka Inoue (Associate Professor, Graduate School of Engineering, Yokohama National University, Associate Professor, Center for Semiconductor Quantum Integrated Electronics, Institute of Advanced Integrated Studies)
●Curriculum●
13:00-14:30 Basics of Chiplet Integration
14:40-16:10 Research Trends and Challenges in Hybrid Bonding
16:10-16:30 Q&A
*Networking session for 30 minutes starting at 16:30
<Contact>
Kanagawa Institute of Industrial Science and Technology (KISTEC)
Human Resource Development Department, Education and Training Group
E-mail: manabi@kistec.jp

Date and time | Friday, Sep 05, 2025 |
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Capital | Kanagawa Science Park (3-2-1 Sakado, Takatsu Ward, Kawasaki City, Kanagawa Prefecture) |
Entry fee | Charge 15,000 yen (including tax and text fee) |
More Details & Registration
Details & Registration
Distributors
Public interest/special/independent administrative agency
(地独)神奈川県立産業技術総合研究所 人材育成部 教育研修グループ(溝の口支所)