Launch of the Next-Generation IC Substrate AOI “SX7000” Series and Laser Repair System “LX7000”

In response to the rapid advancement of chiplet integration*¹ and finer wiring in semiconductor package substrates—driven by the explosive growth of the AI market—we are pleased to announce the launch of our next-generation semiconductor package substrate AOI system, the “SX7000” series, and our “LX7000” laser repair system. Orders are now being accepted.
*1 A technology that divides what was traditionally integrated on a single large silicon die into multiple smaller chips, each responsible for a specific function, and connects them at high speed within a single package. This approach is increasingly being adopted in high-performance processors for AI applications.
■Line/Space
SX7400:1.5μm/1.5μm~
SX7300:2μm/2μm~
LX7000:2μm/2μm~
■Target product size
SX7400:615mm × 515mm
SX7300:615mm × 515mm
LX7000:615mm × 515mm


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