INSPEC Inc. Company Profile

In response to the rapid advancement of chiplet integration*¹ and finer wiring in semiconductor package substrates—driven by the explosive growth of the AI market—we are pleased to announce the launch of our next-generation semiconductor package substrate AOI system, the “SX7000” series, and our “LX7000” laser repair system. Orders are now being accepted. *1 A technology that divides what was traditionally integrated on a single large silicon die into multiple smaller chips, each responsible for a specific function, and connects them at high speed within a single package. This approach is increasingly being adopted in high-performance processors for AI applications. ■Line/Space SX7400：1.5μm/1.5μm～ SX7300：2μm/2μm～ LX7000：2μm/2μm～ ■Target product size SX7400：615mm × 515mm SX7300：615mm × 515mm LX7000：615mm × 515mm