We will exhibit at the 2nd Semiconductor Industry Exhibition to be held in Kyushu in 2025.

Standard products available in a variety of sizes, customization is also OK! *Currently offering product samples to 10 people by lottery.

Our company offers "rubber collets" that are less likely to cause semiconductor chip carry-out errors due to their low adhesion and are easy to replace. We have a wide range of standard sizes available and can also accommodate customizations according to your needs. Additionally, we strive for reasonable pricing. Currently, we are giving away product samples to 10 people through a lottery. If you are interested, please feel free to apply via the [Contact Form]. [Features] ■ Available in round, square, and rectangular tip shapes ■ We generally cover the mold costs for custom tip sizes ■ Made of rubber to avoid scratches on chip surfaces ■ Compliant with RoHS directives <Please consider adopting ORUTE as your partner!> (1) We have unique products with excellent functionality and extensive experience and track record. (2) We provide products that can address and solve your company's challenges. (3) We comply with regulations on chemical substances contained in products, such as RoHS. *For more details, please refer to the comprehensive catalog of our products available for download. *Our company will be exhibiting at the "1st Semiconductor Industry Exhibition" held at Marine Messe Fukuoka B Hall on September 25 (Wednesday) to 26 (Thursday).

• Other semiconductor manufacturing equipment

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

HP Inc. will hold the "HP Future of Work AI Conference 2025" at Tokyo International Forum, Hall B. At this event, under the message "Freedom to be particular about how we work," we will introduce the possibilities of on-device AI and its practical applications, along with case studies and technological trends. Whether you are considering implementing AI or have already started using it, you are sure to find hints for your next steps. We sincerely look forward to your attendance.

Nitto Kohki will exhibit at the "30th Mechanical Components Technology Exhibition [Tokyo]" held at Makuhari Messe Hall 5 from July 9 (Wednesday) to July 11 (Friday). [Booth Number: Hall 5 31-32] At this exhibition, we will showcase a variety of products, including the electric suction hand "e-VEE" with a built-in pump that does not require compressed air, a cordless belt sander, the electric driver "Delvo" that can be mounted on robots, and the "Flow Monitor" that allows for easy visualization of the flow of cooling water in molds and other applications.

Providing Solutions to Support Your Business Challenges We warmly invite you to visit our booth at K 2025 to learn more about our approach and explore our latest innovations. 【K 2025】 – The World's No.1 Trade Fair for Plastics and Rubber Exhibition Dates : October 8 (Wed) – October 15 (Wed), 2025 Venue : Messe Düsseldorf, Düsseldorf, Germany Opening Hours : 10:00 AM – 6:00 PM (local time) MATSUI Booth : Hall 11 – Booth I53

[Lecturer] Kazuhisa Yuki, Professor, Department of Mechanical Engineering, Faculty of Engineering, Yamaguchi University of Science and Technology [Key Lecture Content] Currently, the world is facing a serious energy crisis and environmental issues. Particularly, due to the rapidly growing highly information-oriented society, the power demand of global AI data centers is expected to double from the 2024 level, surpassing Japan's total electricity consumption. In the future, to achieve a rich highly information-oriented society while maintaining carbon neutrality, securing a cheap and stable power supply is essential, and energy conservation in data centers will become the most important challenge. Against this backdrop, two-phase liquid immersion cooling technology, which can significantly reduce power input associated with cooling while achieving high cooling performance, is attracting attention. In this lecture, we will discuss efficient cooling technologies for data centers, evaluated based on cooling performance (air cooling/liquid cooling/liquid immersion technology), and outline the potential and technical challenges of liquid immersion cooling technology in particular.