Prevention of semiconductor chip removal: "Replaceable Rubber Collet"

This time, Orte Corporation will exhibit at "Kyoto Pulse Plaza" again this year, following our participation in last year's semiconductor exhibition. The latest cutting-edge collets that can only be seen here will be on display! Our specialists in chip transport collets will unveil the latest lineup that solves on-site "troubles"! Be amazed by our rubber collet that achieves a contact width of less than 0.1mm! Of course, we have rubber collets that address ionizer countermeasures, as well as patented holder mechanisms that perfectly accommodate high-aspect and large chips. You will surely find yourself thinking, "This is the collet I wanted!"... We plan to showcase many actual samples! You can actually hold, touch, and experience the performance on the spot. Please come and visit our booth! We are confident that you will definitely think, "I'm glad I came to see this!" 【Exhibition Contents】 - Pickup collets (rubber/plastic/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays)

This time, Orte Corporation will exhibit at the "2nd Kyushu Semiconductor Industry Exhibition," continuing from last year. As a specialized manufacturer of collets for chip transport, we will introduce a variety of cutting-edge products that respond to the latest assembly processes, including rubber collets for ionizer countermeasures and patented holder mechanisms that can accommodate high-aspect and large chips. Particularly noteworthy is the rubber collet with a U-shaped recessed type that achieves a contact width of less than 0.1mm between the chip and the collet, utilizing ultra-precision processing technology. It is also compatible with optical devices and bumped chips, making it ideal for high-precision applications that require flatness at the collet tip. We will have sample displays of our products, including collets, so please feel free to stop by our booth. 【Exhibition Contents】 - Pickup collets (rubber/plastic/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays)

We are Orte Corporation, a limited company. We will be exhibiting at our booth at the "1st Kyushu Semiconductor Industry Exhibition," which will be held from September 25 in the attention-grabbing region of Kyushu. In recent years, interest in semiconductor manufacturing in Japan has been rekindled against the backdrop of the establishment of semiconductor factories in Kumamoto Prefecture. We encourage you to visit the event during this opportunity. Our exhibition will feature various products, including the new "white and gray rubber collets" and "ultrasonic cleaning machines" that can be applied to various purposes and processes. Exhibition Contents: - Pickup collets (rubber/resin/metal/others) - Ultrasonic cleaning machines and ultrasonic oscillators - Consumables and maintenance parts for post-semiconductor manufacturing (third-party products) - Die bonding related parts (upward needles, dispense nozzles) - Wire bonding related parts (window clampers, finger clamps) - Outsourced parts cleaning services (capillaries, wedges, maintenance parts) - Transport parts (magazine racks, IC chip trays) - Micro 3D printer BMF MicroArch