Technical Outlook on Co-Packaged Optics (CPO) and Optical Element Connection and Bonding [Web Seminar]

This seminar will cover the latest trends and prospects of Co-Packaged Optics, a key technology in photonic-electronic integration, which is being developed both domestically and internationally. Four experts will explain the technological trends in data centers, changes in optical interconnect implementation forms, CPO technology, and the connection and bonding techniques of optical components that meet the demands for high performance, high quality, and low cost.

Date and time | Thursday, Oct 30, 2025 10:00 AM ~ 04:50 PM |
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Entry fee | Charge 55,000 yen |
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