Power Electronics Technology Trends for xEVs [Tokyo Venue + Web Seminar]

Detailed explanation of the latest evaluation technologies for next-generation power semiconductor devices and materials, as well as cutting-edge simulation technologies.

This book, "Challenges and Evaluation Technologies of Next-Generation Power Electronics," is edited around silicon power semiconductors, which are currently the main players, and next-generation power semiconductor devices based on wide bandgap materials, which will be at the center of next-generation power electronics. It provides detailed introductions not only to semiconductor crystals, device design, process equipment, and high-temperature mounting technologies, but also to the latest evaluation technologies regarding material properties and device characteristics, as well as cutting-edge simulation technologies. It thoroughly covers a wide range of topics, including applications in automotive and communication devices, which are expected to grow significantly in the future, as well as developments in industrial equipment, including home appliances and railways. I hope this book will be greatly helpful in expanding the adoption of next-generation power semiconductor devices towards the realization of a decarbonized society.

• Technical and Reference Books

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

On this occasion, we have opened a showroom for Tajima embroidery machines in conjunction with the renovation of the Chūnichi Jūki headquarters building. To commemorate the opening of the showroom, we will hold an exhibition of Tajima embroidery machines.

Next-generation large resin and metal 3D printers that achieve astonishing high-speed molding, low-cost, and high-precision molding are being rapidly introduced to the market. These printers are being utilized in the manufacturing of large parts and products in the aerospace, automotive, industrial machinery, plant, defense, and social infrastructure sectors, as well as in parts and mold repairs and reverse engineering. In this seminar, we will discuss the latest developments and features of cutting-edge machines from Stratasys, the largest manufacturer of large resin 3D printers, and Lobotics, along with domestic and international case studies. We will also explore innovative molding technologies from leading users such as Fujikohsai Industries and Sanko Gosei, who utilize large metal 3D printers from Meltio and Matsuura Machinery to create large metal parts, large metal products, and large mold components. The seminar will provide concrete and easy-to-understand explanations of key points and considerations for implementation and utilization, various manufacturing examples, and discussions on molding size, quality, cost, lead time, and success and failure stories. 3D printers enable the complex integrated molding of multiple parts into a single large shape, which was impossible with previous processing methods and technologies. This capability allows for a significant reduction in the number of parts, achieving short lead times, low costs, high-quality manufacturing, and a reduction in the number of processes and personnel involved.

Copper, which has a high laser reflectivity and quickly dissipates the thermal energy from laser irradiation, was difficult to shape using metal 3D printers. However, recently developed high-performance and high-functionality metal 3D printers, along with pure copper and copper alloy powders that have a high laser absorption rate and excellent 3D moldability, have been introduced to the market, and practical applications are rapidly advancing in leading companies. Metal 3D printers enable the creation of complex shapes and integrated structures, lattice/porous structures, and hybrid structures that were previously impossible, allowing for the innovation of parts, rapid development and prototyping of components, significant reduction in the number of parts, improved quality, lightweight and compact designs, and cost reduction. This has led to increased adoption and utilization in applications such as heating coils, heat sinks, heat exchangers, motor coils, and electronic and electrical devices. In this seminar, we will provide a clear and detailed explanation of the latest trends in pure copper and copper alloy powders suitable for 3D additive manufacturing, developed by Fukuda Metal Foil Powder Industry, as well as case studies of layered molding with pure copper and copper alloys. We will also discuss innovative molding technologies and examples that are unique to our company, as demonstrated by leading users such as TK Engineering, ODEC, and Fasotec, who are utilizing metal 3D printers to manufacture low-cost, high-quality copper components in a short time, sharing both success and failure stories.

We will hold an in-person event to introduce the latest technologies in molecular design. In addition to updates on the molecular design platform "Orion," we are scheduled to have cutting-edge research presentations by OpenEye and external speakers, including "the discovery of new leads by adding three-dimensionality to trillion-scale virtual screening" and "the identification of cryptic pockets that expand druggable areas." Furthermore, we will be introducing the next-generation shape similarity search tool "ROCS X," which was first unveiled at miniCUP Boston, for the first time in Japan at this event. ROCS X evolves the traditional ROCS, enabling faster and more accurate three-dimensional screening, contributing to the efficiency of lead discovery in drug research. Don't miss the latest technologies that accelerate the drug discovery process, including molecular modeling, structure-based drug design, and AI-driven screening! We look forward to your participation.