A perspective beyond the pump framework: The impact of system components on liquid pump performance.

High discharge liquid pump with a maximum allowable discharge pressure of 0.6 MPa (60 mWg)

High discharge liquid pump with a maximum allowable discharge pressure of 0.6 MPa (60 mWg) It can be used for liquid transfer in high pressure loss resistance flow paths, high-pressure cleaning, and mist generation through nozzles or orifices. - Flow rate adjustment is possible with brushless motor control. - Self-priming - Abundant wetted material options (EPDM / PTFE) - Maintenance-free, contamination-free Basic flow rate: 650 ml/min Maximum allowable discharge pressure: 0.6 MPa (6 bar / 6 mWg) Suction lift: 3 mWg

• Other pumps

Pulsation Reduction Gentle Flow Diaphragm Liquid Pump

- The pulsation reduction feature allows for the transfer of liquids with minimal pulsation. - Due to the reduced pulsation, pressure loss in the tubing can be minimized. - It enables the transfer of liquids with fewer air bubbles. - It can reduce the optional parts for pulsation reduction measures. - Equipped with a newly developed valve, it can achieve self-priming suction even at lower motor speeds. - Flow rate adjustment is possible through brushless motor control. - Materials with NFS certification are also available. Basic flow rate: 700 ml/min Diaphragm material: EPDM / PTFE

• Other pumps

Features: ● Equipped with ARM MediaTek Genio 700 / 510 ● Onboard LPDDR4 8GB ● HDMI 2.0 x 1, DP 1.4 x 1 ● eDP 2 lanes x 1, MIPI-DSI 4 lanes x 1 ● GbE x 1 ● USB 3.0 + 2.0 x 1, USB 2.0 x 5 ● UART x 4, GPIO x 12, MIPI CSI x 2, TPM 2.0 ● Fan-equipped heatsink, heatsink available separately ● Carrier board available separately

Features: ● Equipped with Intel Core Ultra 5 125H/7 155H ● LPDDR5 16GB onboard memory ● NVMe 128GB onboard storage ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen2 x 2 ● PCIe 4.0[x1] x 4 ● 2.5GbE x 1 ● COMe Type10 standard, size 84mm x 55mm ● Optional items ECB-920A-0001: Development carrier board NANOCOM-MTU-FAN: CPU fan NANOCOM-MTU-HSP: Heat spreader (Note: Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM x2 (up to 96GB) (sold separately) ● VGA switch DDI x1, LVDS colay eDP x1, DDI x2 ● USB 2.0 x8, USB 3.2 Gen 2 x4 ● PCIe [x1] x4, PCIe [x4] x1, PEG [x8] + [x4] + [x4] ● 2.5GbE x1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches x 3.75 inches (95mm x 95mm)

By digitizing contract operations, you can reduce many costs, including stamp duty and mailing fees. ◆ Four Benefits of Electronic Contracts - Cost reduction for printing, stamp duty, mailing fees, and original document storage - Improved business efficiency through system-based sending and stamping - Prevention of tampering with timestamps - Enhanced document searchability 【Many Benefits for the Other Party as Well!】 - Both parties can confirm that the document has not been tampered with - No worry about losing the original paper documents - Increased operational efficiency due to the absence of mailing and binding hassles - Quick contract conclusion through email or system verification ◆ Disadvantages of Electronic Contracts - Costs for implementing and operating the service - Need to ensure that business partners understand electronic transactions ----------------------------------------------------- 　　Consult with paperlogic for electronic contract services! -----------------------------------------------------

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.