Latest Trends in Cooling Technologies for AI Data Centers [Web Seminar]
With the utilization of AI and the widespread adoption of social media, the exchange of vast amounts of data has become common even on the smartphones we use daily. On the other hand, we can easily access this data without being aware of the existence of data centers. However, it is not widely known that data centers located around the world consume enormous amounts of electricity every day. Much of the consumed power is used to directly drive the hardware, but a significant portion of the remaining power is used to cool that hardware. Data centers employ various cooling methods, including air cooling, liquid cooling, and immersion cooling. In this seminar, we will explain the characteristics, advantages, and disadvantages of each method, aiming to clarify the cooling technologies within data centers, which can be difficult to grasp as a whole, from a macro perspective. Additionally, we will discuss the various heat dissipation devices used in modules within racks, addressing each method individually. In particular, we plan to take time to clearly explain the technology trends, principles, and usage of fans and heat sinks in air cooling, cold plates in liquid cooling, and TIM (Thermal Interface Material) that facilitates heat transfer at interfaces.

| Date and time | Wednesday, Feb 04, 2026 01:00 PM ~ 04:30 PM |
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| Entry fee | Charge 46,200 yen |
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