<Online Customer Factory Tour> High-quality manufacturing that does not depend on skills or experience.

Bending machine equipped with a new servo drive system that reduces environmental impact and maintenance costs.

The "EGBe series" is a servo bending machine that reduces setup time through automation. With the addition of new options, it has evolved into an environmentally friendly machine that allows for high-precision and complex processing without mistakes or hesitation, making it usable even for beginners. Additionally, it reduces CO2 emissions by up to 20% and oil consumption by approximately 90%, lowering environmental impact and maintenance costs. 【Features】 ■ Reduces CO2 emissions by up to 20% ■ AMNC 4ie ■ AMNC 4ie facial recognition (user authentication) ■ Reduces standby power consumption ■ Compatible with safety device AS-01 ■ Enhanced visibility back gauge *For more details, please refer to the related links or feel free to contact us.

• Other processing machines

Shortened new product launch time with sensing functionality! Easy setup, compact electric servo bending automation system.

The "EGB-6013ARce" is a machine equipped with new 4ie technology that is user-friendly for beginners, can be used anywhere, and is environmentally conscious. The portable tablet HMI can display product setup information, and along with the movable loading cart, it reduces the burden of transferring blank materials. Additionally, by incorporating sensing functions, the time required for launching new products has been shortened, making it easier for beginners to make adjustments. 【Features】 ■ AMNC 4ie ■ 6-axis articulated robot ■ L-shift back gauge + side gauge ■ Mobile loading cart ■ Tablet HMI ■ Tool stocker *For more details, please refer to the related links or feel free to contact us.

• Other processing machines

Equipped with a new servo drive system, this high-end bending automation system is designed with environmental considerations in mind. Pioneering the future of bending automation with selectable peripheral devices!

The "EGB-1303ARse" is a high-end bending automation system equipped with a new servo drive system, designed with consideration for the environment. It is a machine that can be used by beginners and at any time, achieving a pallet operation without the need for reloading through the newly introduced Amada Smart Loading Device. Additionally, by menu-izing the unloading function, customers can select peripheral devices according to their operations. 【Features】 ■ AMNC 4ie ■ 6-axis articulated robot ■ L-shift back gauge + side gauge ■ Robot tablet HMI ■ AGC (Auto Gripper Changer) ■ Sensing function *For more details, please refer to the related links or feel free to contact us.

• Other processing machines

Environmentally friendly high-precision servo bending machine! Compact design with automatic mold exchange device.

The "EGB-6020ATCe" is a servo bending machine that considers both people and the environment, pioneering the future of bending with operator support functions and a new servo drive system. It features fully automated opening and closing of the ATC shutter and a pinch prevention function, ensuring both operator safety and work efficiency. Additionally, we also offer the "EGB-1303ATCe" with a pressing capacity of 1300kN. Please feel free to contact us if you need assistance. 【Features】 ■ Reduces CO2 emissions by up to 20% and oil usage by approximately 90% ■ Lowers environmental impact and maintenance costs ■ Equipped with AMNC 4ie ■ AMNC 4ie facial recognition (user authentication) ■ Reduces standby power consumption ■ Equipped with safety device AS-01 *For more details, please refer to the related links or feel free to contact us.

• Other processing machines

[Tokyo] The "Practical Solution Fair 2026," hosted by Otsuka Corporation, will be held from February 4 (Wednesday) to February 6 (Friday), 2026, in Tokyo, and from February 18 to February 19 (Thursday) in Osaka. We would like to inform you that paperlogic's electronic contract and paperlogic's construction document DX pocket will each have a booth at the event. The Practical Solution Fair is Otsuka Corporation's largest IT comprehensive exhibition held once a year. The theme is "Expanding with AI! Complete DX." Paperlogic will also promote the DX of your business document management using AI technology. [Event Information - Tokyo Venue] Date: February 4 (Wednesday) to February 6 (Friday), 2026 (Registration starts at 9:30 / Registration ends at 17:00 *Entry on the first day starts at 10:00) Venue: The Prince Park Tower Tokyo Address: 4-8-1 Shiba Koen, Minato-ku, Tokyo Participation Fee: Free (Pre-registration required) Deadline: Until 17:00 on the day of the event [How to Participate in the Tokyo Venue] To participate in the Practical Solution Fair, please proceed to the registration link from the related links. *An Otsuka ID is required for registration.

We will hold an online customer factory tour at Fukazawa Manufacturing Co., Ltd. in Ashigarakami-gun, Kanagawa Prefecture, which has recently introduced the servo bending machine "EGB-1303ATCe" equipped with an automatic mold exchange device that considers both people and the environment. On the day of the event, we will conduct interviews with representatives and staff, where they will share the secrets behind achieving quality and delivery times comparable to those of veteran employees by young workers. Attendees will also be able to see the processing of high-difficulty bending products that fully utilize the machine's functions and performance. Additionally, we will answer questions from viewers in a live format.

Our company will be exhibiting at "BATTERY JAPAN 2026," which will be held at Tokyo Big Sight for three days from March 17 (Tuesday) to March 19 (Thursday), 2026. <BATTERY JAPAN 2026> Dates: March 17 (Tuesday) to March 19 (Thursday), 2026, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, South Hall 4 Booth Number: S24-13 At this exhibition, we will showcase the following products from our company: - EDLC Modules (Standard type, Heat dissipation type, Type with fan) - EDLC Application Products (Jump starters, Hybrid [EDLC + Lithium-ion battery integrated]) - Battery Products (AGM, Lithium-ion) Additionally, we will display a demonstration unit that combines a small press machine with EDLC, allowing you to understand the effectiveness of EDLC usage. We sincerely apologize for the inconvenience during your busy schedule, but we humbly invite you to visit us at this opportunity.

Are there any tasks such as on-site reports, inspections, or daily reports that you think would be convenient if they could be done with an app, but have not been realized yet? In this seminar, we will introduce how easily business apps can be created using the no-code tool "Platio," and how they are used on-site, focusing on actual screen demonstrations. By observing the flow of app creation and the user experience, you will be able to determine if Platio fits your company's operations and visualize how it can be utilized. This seminar is recommended for those who have heard of Platio but want to know specifically what it can do and how it can be used.

[Speaker] Kuniaki Suzuki, General Manager, Cloud & AI Services Division 1, AI Platform Development Headquarters, SoftBank Corp. [Key Lecture Content] AI technology is advancing at an accelerating pace, and the likelihood of achieving AGI within the next few years is increasing. Under the philosophy of promoting the social implementation of AI to realize a true digital society, SoftBank is making large-scale investments and developments in various technologies and infrastructures as part of its next-generation social infrastructure initiative. This lecture will introduce the overall picture of the next-generation social infrastructure initiative and its efforts, discussing the market conditions and challenges in Japan that form the background, as well as SoftBank's approaches and specific initiatives to address these challenges. [Lecture Items] 1. Current digital environment and future trends 2. Challenges in Japan 3. About the next-generation social infrastructure initiative 4. Initiatives (data centers/cloud computing infrastructure/AI) 5. Q&A / Business card exchange