KELLER will exhibit at the Hydrogen and Fuel Cell Expo! March 17-19, 2026 at Tokyo Big Sight, West Hall 2, W15-36.

The pressure sensor for hydrogen applications has finally arrived!

The 23SY-H2(Ei) series is characterized by a low embrittlement rate due to an increased nickel content in the stainless steel used. The gold-plated diaphragm minimizes hydrogen diffusion. Additionally, the pressure sensor is compensated across the entire temperature range, providing excellent long-term stability. The 23SY-Ei-H2 series is a reliable solution equipped with long life, high precision, and safety, meeting various hydrogen requirements. 【Features】 〇 Adoption of stainless steel with increased nickel content as a measure against hydrogen embrittlement 〇 Use of gold-plated diaphragm widely used in hydrogen applications to minimize hydrogen diffusion 〇 Achieves ±0.7% accuracy within -10 to 80°C 〇 Excellent long-term stability 〇 Welded structure without internal seals 〇 Available in intrinsically safe explosion-proof type (23SY-Ei-H2)

• Pressure

High-precision pressure sensors for hydrogen applications have finally arrived!

The 23SX-H2 series is characterized by a low embrittlement rate due to an increased nickel content in the stainless steel used. The gold-plated diaphragm minimizes the diffusion of H2. Additionally, the pressure sensor is compensated across the entire temperature range and has excellent long-term stability. The 23SX-H2 series is a reliable solution that offers long life, high precision, and safety, meeting all hydrogen requirements. 【Features】 〇 Adoption of stainless steel with increased nickel content as a countermeasure against hydrogen embrittlement 〇 Use of gold-plated diaphragm widely used in hydrogen applications to minimize hydrogen diffusion 〇 Achieves ±0.25% accuracy within -10 to 80℃ 〇 Standard equipped with two outputs: digital RS485 and analog output 〇 Analog output can be range-changed via digital RS485 〇 Excellent long-term stability 〇 Welded structure without internal seals 〇 Available in intrinsically safe explosion-proof type (33X-Ei-H2)

• Pressure

The digital pressure gauge for hydrogen applications has finally arrived! With logging function.

The high-precision digital pressure gauge LEO Record H2 is a digital pressure gauge that can record pressure and temperature over long periods. By increasing the nickel content in stainless steel, it ensures a low embrittlement rate and a long service life. Additionally, the gold-plated diaphragm minimizes the diffusion of H2. With the RS485 interface, the pressure gauge can be easily connected to a PC for settings and data retrieval. Its high accuracy and safety allow the LEO Record H2 to meet the requirements for measuring instruments in the hydrogen field. 【Features】 • Use of stainless steel with increased nickel content to counter hydrogen embrittlement • Gold-plated diaphragm to minimize hydrogen diffusion • Records pressure and temperature • High data security with non-volatile memory • Ultra-low power consumption / long battery life • Various pressure units selectable (bar, mbar, hPa, kPa, MPa, PSI, kg/cm2, etc.) • Zero point calibration via button • Recording function can be manually started and stopped • Various recording function settings available • Available in intrinsically safe explosion-proof type (LEO-Record-Ei-H2)

• Pressure

We will hold an online seminar as follows. The corporate perspective on the introduction of monitoring systems is changing year by year. We will explain the monitoring systems for machine tools that are currently needed, using various case studies to discuss the changes in the industry environment, what challenges customers perceive, their expectations for monitoring systems, and the effects of their implementation. This seminar will provide insights into specific approaches for your company's introduction of monitoring systems. Date and Time: February 12, 2025 (Thursday) 14:00 - 15:00 Instructor: Monitoring System Representative, ARTIS (MARPOSS Corporation Sales Development Department) Target Audience: - Customers considering the introduction of monitoring systems who want to know the specific process leading to implementation. - Customers interested in what challenges other companies have identified that led to the introduction of monitoring systems. - Customers researching the latest trends in monitoring systems for machine tools. We sincerely look forward to your participation.

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. A leading expert thoroughly organizes practical perspectives from WLP/PLP to high thermal conductivity materials. ■ Title: Basic Information on Semiconductor Packaging Technology: Comprehensive Explanation ■ Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM ■ Target Audience for the Seminar - Individuals involved in semiconductor packaging (sales, technology) - Those interested in semiconductor packaging technology - Those interested in semiconductor resin encapsulation and encapsulation materials ■ Knowledge Gained from the Seminar - Development history of semiconductor packaging (PKG) - Development history of semiconductor packaging technology (methods, materials) - Specifications of semiconductor encapsulation materials (raw materials, composition, manufacturing equipment, evaluation methods, etc.)

■Title: "Fluorine-Free Water and Oil Repellent Treatment Technology Achievable - Guidelines and Examples for Surface Design to Improve Wetting Fundamentals and Liquid Sliding Properties" As PFAS regulations accelerate, surface designs that achieve water and oil repellency without fluorine are gaining attention. This seminar will systematically explain the fundamentals of wetting, dynamic wettability evaluation, design guidelines for improving sliding properties, and the latest examples of fluorine-free surface treatments by leading researchers. ■Date and Time: April 14, 2026 (Tuesday) 13:30 - 16:30 ■Target Audience for the Seminar - Individuals engaged in surface treatment and modification operations - Those involved in research and development related to imparting water and oil repellency, stain resistance, and anti-adhesion properties to various substrate surfaces - Individuals engaged in research and development of fluorine (PFAS) alternative technologies and fluorine-free surface treatment and modification technologies ■Knowledge Gained from the Seminar - Fundamental knowledge/theory regarding wettability - Correct knowledge of wettability evaluation techniques (static/dynamic contact angle, contact angle hysteresis, sliding/falling angle) - Know-how for creating surfaces/interfaces with excellent water and oil repellency, stain resistance, and anti-adhesion properties without fluorine

The "Jumbo Surprise Exhibition," which solves the challenges faced by the manufacturing industry all at once, will be held again this year. In the FA zone, the latest FA equipment, control and drive devices, and energy-saving and labor-saving proposals will be displayed all in one place. You can experience concrete solutions that are immediately useful on-site, such as automation, productivity improvement, equipment renewal, and maintenance efficiency. Representatives from each manufacturer will be available to provide direct explanations, making it a great opportunity to learn about the latest trends and case studies. If you are looking for hints to solve your challenges or considering new equipment investments, please come and visit us. We will provide encounters that will lead your business to the next stage.

■Title: "Flexible Substrates and FPC Formation Technology for 5G/6G - LCP-FCCL and Its Development" ――A must-see for developers of high-frequency FPCs. Provides knowledge useful for future FPC substrate design, from the key technologies for LCP multilayering to examples of new low-dielectric films. ■Date and Time: April 15, 2026 (Wednesday) 13:30 - 16:30 ■Target Audience for the Seminar 　Development engineers engaged in the development of high-frequency FPCs and their substrates ■Knowledge Gained from the Seminar 　・Basic properties required for FPC substrates 　・Reasons for using LCP and polyimide films in FPCs 　・Key technologies for LCP multilayering 　・Points to consider when processing LCP films 　・Examples of hybridization methods between LCP and low-dielectric materials