4/15 Webinar "Flexible Substrates for 5G/6G"
■Title: "Flexible Substrates and FPC Formation Technology for 5G/6G - LCP-FCCL and Its Development"
――A must-see for developers of high-frequency FPCs. Provides knowledge useful for future FPC substrate design, from the key technologies for LCP multilayering to examples of new low-dielectric films.
■Date and Time: April 15, 2026 (Wednesday) 13:30 - 16:30
■Target Audience for the Seminar
Development engineers engaged in the development of high-frequency FPCs and their substrates
■Knowledge Gained from the Seminar
・Basic properties required for FPC substrates
・Reasons for using LCP and polyimide films in FPCs
・Key technologies for LCP multilayering
・Points to consider when processing LCP films
・Examples of hybridization methods between LCP and low-dielectric materials

| Date and time | Wednesday, Apr 15, 2026 01:30 PM ~ 04:30 PM |
|---|---|
| Entry fee | Charge 44,000 yen (including tax) |
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