CMC RESEARCH Ltd. Company Overview

■Title: "Fundamentals and Applications of Fine Bubble Technology - From the Design and Measurement Evaluation of Generation Devices to Why Ultra Fine Bubbles Exist Stably -" This presentation systematically explains fine bubble technology, which is being increasingly utilized in a wide range of fields such as water treatment, agriculture, fisheries, food, cleaning, and chemical processes, starting from the basics. It covers the characteristics of microbubbles and ultra fine bubbles, the principles of generation, device selection, measurement evaluation methods, as well as the concept of dispersion stability, which is gaining attention as a reason for their long-term existence, and the latest research trends. - Basic knowledge of fine bubbles - Characteristics of microbubbles and ultra fine bubbles - Principles and selection methods of generation devices - Measurement and evaluation techniques for fine bubbles - Concepts regarding the stability of ultra fine bubbles - Case studies of applications in agriculture, fisheries, environment, and cleaning - For those who want to start developing fine bubble technology - For engineers engaged in commercialization and product development - For personnel in the fields of water treatment, cleaning, agriculture, and fisheries - For those who want to learn the fundamentals of fine bubble technology

■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors

**Title: "How to Tackle the Confusing Issues of Plastic and Fiber? - The Future of Resource Circulation Technology Transforming Material Life Cycles"** - In the context of the global waste problem of discarded plastics and fibers, this presentation systematically explains material recycling, chemical recycling, advanced separation technologies for composite materials and blended fibers, as well as the utilization of biomass plastics. You will also learn about cutting-edge separation technologies using microwave selective heating and the latest domestic and international regulations and market trends. - Overview of the technology system and latest trends in plastic recycling - Characteristics and challenges of material recycling and chemical recycling - Advanced separation and resource recovery technologies for blended fibers and composite materials - Regulations and market trends related to waste plastics - The necessity and latest trends of biomass plastics - Perspectives on achieving resource circulation and carbon neutrality - Researchers and developers of plastic recycling technologies and separation technologies - Engineers in the chemical, textile, apparel, and recycling industries - Personnel responsible for promoting ESG, CSR, and sustainability - Individuals interested in resource circulation and biomass utilization