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Chiplets are a technology that integrates multiple chips into a single package, necessitating new testing methods not only for traditional chip-level testing but also specifically for chiplets. This course will introduce the fundamental technologies of electronic circuit testing, followed by an overview of chiplets, the concepts of chiplet testing, testing methods for true KGD (Known Good Die) selection, challenges and latest trends in wafer probing, testing of interposers, system-level testing, SDC (Silent Data Corruption), boundary scan for chiplet interconnect testing and the IEEE 1838 standard, TSV connection failure repair methods and the UCIe standard, as well as new measurement methods to evaluate ultra-narrow pitch TSV connections such as hybrid bonding. Target Audience for the Seminar: Individuals interested in the implementation and testing of chiplets. Knowledge Gained from the Seminar: - Basic knowledge of electronic circuit testing - Overview of chiplets - Concepts and trends in chiplet testing - Basic knowledge of boundary scan and chiplet testing standard IEEE 1838 - TSV connection failure avoidance technologies and UCIe standard - New evaluation techniques for TSV connections using analog boundary scan

The non-contact power supply system is a technology that spans multiple fields, making it impossible to address with fragmented knowledge from individual areas. Measured data and simulation results will be handled uniformly and shared among stakeholders from various fields. This will facilitate an easier understanding of the development challenges and product trends related to non-contact charging technology using the MIT method. 【Target Audience for the Seminar】 Technical sales representatives and product planners, as well as product developers for non-contact charging systems (MIT method). 【Knowledge Gained from the Seminar】 Participants will understand the technical positioning of non-contact charging technology (MIT method) based on resonance and will be able to explain why the MIT method enables high-efficiency energy transfer. Additionally, they will be able to consider countermeasures for electromagnetic noise associated with non-contact charging.

This seminar provides an overview of the fundamentals of microwave heating technology and its engineering applications, focusing on drying and chemical synthesis. It aims to help researchers in materials and chemistry understand the basic knowledge necessary to utilize microwave heating for the first time. Various challenges observed in microwave processes will be introduced, along with countermeasures from the perspectives of heating engineering and electromagnetics. The seminar will also present indicators for assessing the potential for the practical application of microwave heating processes, as well as introduce the non-equilibrium effects in micro-regions generated by microwave heating and the academically unknown microwave effects. 【Target Audience】 - Engineers and researchers from companies considering applications of microwave chemistry - Engineers and researchers contemplating the adoption of microwave heating technology in their own companies - Individuals engaged in chemical engineering processes such as heating and drying who wish to overcome current challenges - Those looking to reduce process costs by accelerating firing and chemical reactions 【Knowledge Gained from the Seminar】 - Fundamentals of microwave heating - Basics of microwave chemistry (fundamentals of chemical reactions using microwaves) - Applications of microwave processes - Design of microwave heating furnaces