"Micro Joining and Assembly Technology in Electronics" Symposium

Organizer:
(General Incorporated Association) Smart Process Society Electronics Production Science Division
(General Incorporated Association) Welding Society Micro Joining Research Committee
Presentation Content:
◆ [A-5] Power Devices 2 (Venue A) 13:40–15:20
Development and Evaluation of Copper Nano-Sintering Joining Material for SiC Power Devices
◆ Poster Presentation (Venue A) 15:45–16:25
Sintered Material of Conductive Copper Paste with Excellent Oxidation Resistance and Sinterability

Date and time | Tuesday, Feb 02, 2016 ~ Wednesday, Feb 03, 2016 08:30 AM ~ 06:00 PM |
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Capital | Event period: February 2, 2016 - February 3, 2016 Venue: Pacifico Yokohama Conference Center (1-1 Minatomirai, Nishi Ward, Yokohama City) |
Entry fee | Charge |
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