Developed a new thermal conductive gap filling material, Gap Pad HC 5.0.

■Development Background
As electronic components become smaller, their power density has increased, leading to a greater demand for thermal management. Components and substrates used in infrastructures that utilize the Internet and computers require excellent thermal conductivity, which is why we developed Gap Pad HC 5.0.
By using Gap Pad HC 5.0, it is possible to lower the junction temperature and improve the performance of devices. This product is a thermally conductive gap filling material designed for next-generation applications with high power density.
■Features
Gap Pad HC 5.0 is a gap filling material with a thermal conductivity of 5.0 W/m·K. In addition to its high thermal conductivity, it is characterized by high shape conformity and low compressive stress. It exhibits excellent thermal properties even under low loads, making it suitable for applications where it is necessary to minimize stress on components and substrates during assembly. Furthermore, it maintains shape conformity even on surfaces with significant roughness or height differences, achieving quick shape recovery and excellent wettability.

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Henkel's Electronics Division has developed a new product in the sheet form of thermally conductive gap filling material, Gap Pad HC 5.0. Gap Pad HC 5.0 is designed to meet the thermal conductivity requirements for thermal management of miniaturized components and substrates with high power density.