We will exhibit at the Fukuoka Monozukuri Fair 2016 (October 26-28, 2016).

Demo now available! Everything you need for wrapping equipment is here! Polishing equipment for automobiles and hydraulic machinery is also available.

At Japan Engis, which offers a full range of wrapping and polishing equipment, we are currently giving away our "Comprehensive Catalog," which includes the latest products, for free! Notably, we have the 'Bore Finish System' for the automotive and hydraulic industries. This new product improves inner diameter dimensional accuracy compared to traditional honing machine finishes! It significantly enhances production efficiency and reduces costs. Additionally, we have a wide variety of consumables listed, including slurries, brushes, and polishing cloths. ◎ We are currently accepting "live demonstrations" at our lab! Please contact us through "Inquiries." 【Contents Included】 ■ Precision wrapping equipment ■ Multifunctional polishing system "Trinity-Y" ■ Precision large wrapping/polishing equipment ■ Precision grinding machine series ◎ Other items listed include wrapping accessories, diamond slurries, polishing slurries, polishing cloths, wrapping plates, diamond pastes, and polishing materials for mold finishing, among many others!

• Other processing machines

No dilution needed & excellent workability with a non-dripping gel! A substitute for diamond paste!

"HYPREZ Diamond Gel" is a gel-type abrasive that is ideal for polishing molds. Since there is no need to dilute it like diamond paste, it saves the hassle of dilution and ensures uniform polishing power. Additionally, because it is in gel form, it does not run off, providing excellent workability. 【Features】 ■ The gel effect allows the tool to hold the highly dispersed diamond abrasives, demonstrating high polishing performance. ■ Suitable for various applications and materials as a hand wrap. ■ Available in both water-based and oil-based options. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

• Other abrasives

Free gift: 'Handbook of Basic Knowledge on Wrapping & Polishing'!

Nihon Engis Co., Ltd. has an in-house lab capable of developing cutting-edge polishing processing technologies and new materials. Since its founding in 1983, the company has consistently worked to improve wrapping technology through the development of advanced wrapping machines and diamond slurries. We are currently offering the latest handbook titled "Fundamentals of Wrapping & Polishing" created by Nihon Engis for free! 【Contents】 - Positioning of polishing - What is the difference between wrapping and polishing? - Types of wrapping and processing mechanisms - Types and properties of diamond abrasives - Types and characteristics of slurries - What is the principle of classification? - About wrapping devices - Types of wrapping plates - What is Preston's law? - What is the Twyman effect? - Processing examples Additionally, we are offering the latest handbook "Fundamentals of Polishing Processing & Wrapping," which includes various data and processing images related to polishing, for free! *If you are interested, please download it from the link below.

• Wafer processing/polishing equipment

In recent years, the implementation of maintenance DX to achieve "non-stop factories" has become an urgent necessity in manufacturing sites. Amid the trend of factory IoT and data utilization, the use of remote I/O, which can remotely aggregate and collect sensor information and control signals from equipment and sensors dispersed inside and outside the factory, is gaining importance as a foundation for predictive maintenance and condition monitoring. On the other hand, the installation environment for remote I/O is not necessarily limited to control panels or well-conditioned factory interiors. There is an increasing need to collect data in harsh environments, such as outdoor equipment and conditions involving high temperatures, low temperatures, vibrations, and strong electrical noise. Conventional remote I/O systems have struggled to operate stably under such conditions, requiring measures like installation location constraints and additional protective enclosures. Environmentally robust remote I/O with wide temperature support and noise resistance can address these challenges, enabling the expansion of the scope of factory IoT and predictive maintenance to outdoor and remote equipment. In this seminar, we will introduce the lineup of Contec's environmentally robust remote I/O, the "CONPROSYS(R) Robust I/O Series," which includes a total of 23 products.

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Takaya Corporation will exhibit at the 27th Automatic Identification Comprehensive Exhibition, showcasing the latest RFID solution, "Visible RFID." Exhibition Details: ■ RFID Work Performance Collection System No need for a control PC or dedicated software Autonomous reader compatible with HF and UHF bands Cloud transmission with just an internet connection "Visualization" of work performance on a dashboard Integration with BI tools for "visualization of location" is also possible. ■ Newly developed "Visible RFID" autonomous reader Equipped with an LCD touch panel for on-site performance verification Efficient data management with batch transmission Experience the operability through live demonstrations We will also showcase various other products. Please visit the Takaya booth to experience the latest RFID solutions! We look forward to your visit.

[Lecture Topics] 1. Latest Trends in Information and Communication Policy of the Ministry of Internal Affairs and Communications Kei Yano, Deputy Director, Information and Communications Policy Division, Information and Communications Bureau, Ministry of Internal Affairs and Communications 2. Semiconductor and Digital Policies of the Ministry of Economy, Trade and Industry Tomonari Fujishiro, Chief of the General Affairs Section, Commerce and Information Policy Bureau, Ministry of Economy, Trade and Industry / Chief of the Minister's Secretariat 3. DX Vision of the Ministry of Land, Infrastructure, Transport and Tourism Taisuke Okubo, IT Strategy Planning and Coordination Officer, Information Policy Division, Comprehensive Policy Bureau, Ministry of Land, Infrastructure, Transport and Tourism

[Speaker] Mr. Hideo Sugiura, President and CEO of RSI Co., Ltd. [Key Lecture Content] This seminar will provide a clear explanation of data centers, which are becoming increasingly important as a foundation supporting society and economic activities, from the basics. It will organize the roles of data centers and their fundamental business models, illustrating the background of market expansion and the rising demand. Additionally, it will overview the conditions required for location and buildings, as well as the characteristics of the business, highlighting perspectives that differ from conventional real estate. Furthermore, it will address the latest trends such as the proliferation of AI and the introduction of renewable energy, exploring new entry opportunities and future possibilities across various fields. [Lecture Items] 1. What is a Data Center? - The true nature of the "information infrastructure" that supports society 2. Global and Japanese Market Environment - Trends in rapidly expanding demand and investment 3. Business Models of the Industry - From hyperscalers to colocation 4. Location Conditions and Equipment Requirements - From the perspectives of power, communication, cooling, and security 5. Challenges in the Age of AI - Power, cooling, cost, and carbon-free responses 6. Future Outlook - The future of next-generation digital infrastructure and decentralized data centers 7. Q&A / Business Card Exchange