日本エンギス Company Profile

Nippon Engis will exhibit at SEMICON JAPAN 2024, held at Tokyo Big Sight. In addition to the vertical grinding machine "HVG-300ADM," we will showcase our polishing and grinding products. We look forward to your visit. Exhibition name: SEMICON JAPAN 2024 (Venue: Tokyo Big Sight) Booth number: 3714 Event dates: December 11 (Wednesday) to December 13 (Friday)

We have completely renewed the homepage of Japan Engis Co., Ltd.! In pursuit of a more user-friendly website, we have reviewed the design and page structure. Additionally, we have made it compatible with smartphone displays, making it easier to view on any device. Please take a look through the related links below. We will continue to strive to provide our customers with even more valuable information. Thank you for your continued support.

Nihon Engis will be exhibiting at "SEMICON JAPAN 2019," which will be held from December 11 (Wednesday) to December 13 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping device, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries about polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.