Rough grinding and precision grinding performed on a single work table. Suitable for small to medium lot production and research and development.
The Trinity-Y series "HVG-300DSO" is a grinding machine equipped with a two-axis mechanism that allows for both rough and precision grinding on a single work table. Since the workpiece can be mounted in one go, there is no error during attachment and detachment, enabling stable flatness and TTV. With the optional thickness measurement, the actual thickness of the wafer during processing can be measured in real-time, allowing for accurate detection of the endpoint after grinding. [Options] ■ Auto-dress mechanism ■ Thickness measurement system (available in contact and non-contact types) *You can view the product documentation via "PDF Download." Please feel free to contact us for inquiries.
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basic information
【Basic Specifications】 Supported Wafer Size: Equivalent to 4-8 inch wafers Maximum Grinding Wheel Diameter: φmm (Rotation Speed: Up to 4,000rpm) Work Table Dimensions: φ350mm (Rotation Speed: Up to 400rpm) 【Additional Specifications】 - Automatic Dressing Mechanism for Grinding Wheel - Thickness Measurement System (Contact Type, Non-Contact Type) *You can view the product documentation from "PDF Download." Please feel free to contact us for inquiries.
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Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.
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