Perform rough and precision grinding on a single work table. Suitable for small to medium lot production and research and development.
The Trinity-Y series "HVG-200-2Axis" is a grinding machine equipped with two processing axes, allowing for both rough and precision finishing on a single work table. Since the workpiece can be mounted in one go, there is no error during attachment and detachment, enabling stable flatness and TTV. It is suitable for grinding hard and brittle materials and is effective for small to medium lot production and research and development. 【Features】 ■ Compact design contributes to space-saving ■ Special specifications can be provided upon request *You can view the product documentation via "PDF Download." Please feel free to contact us with any inquiries.
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basic information
【Basic Specifications】 Supported Wafer Size: Equivalent to 2-4 inch wafers Maximum Grinding Wheel Diameter: φ200mm (Maximum Speed: 2,000rpm) Work Table Dimensions: φ200mm (Maximum Speed: 400rpm) 【Additional Specifications】 - Auto-dressing mechanism for the grinding wheel - Selection of work stage (Rotary type, Sliding type) - Real-time thickness measurement (Contact type, Non-contact type) *You can view the product documentation from "PDF Download." Please feel free to contact us for inquiries.
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Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.
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