Compact design CMP polishing machine. Recommended for research and development!
The tabletop CMP polishing machine 'EJ-380IN-CH-D' features a compact body that minimizes the installation space. It is a versatile tabletop lapping device that can meet a wide range of needs, from polishing sample pieces and small quantities of various parts for research and development purposes to full-scale precision polishing. <Features> - Automation of precision mirror surface processing - Body design with excellent chemical resistance 【Usable platen outer diameter: Φ380 mm】 Additionally, this device will be exhibited at the 27th Monozukuri World [Osaka] held at Intex Osaka from October 2 (Wednesday) to October 4 (Friday), 2024. Booth number: Hall 6, 38-5* We sincerely look forward to your visit. *Please feel free to consult us if you have any requests.
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basic information
【Exhibition Participation Information】 〈27th Monozukuri World [Osaka]〉 Venue: Intex Osaka Dates: October 2 (Wednesday) - October 4 (Friday), 2024 Opening Hours: 10:00 AM - 5:00 PM Booth Number: Hall 6, 38-5 ★For more details, please request the materials.
Price information
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Price range
P5
Delivery Time
Applications/Examples of results
Polishing of compound semiconductors such as SiC and GaN used in power devices, mechanical parts, hydraulic parts, and mechanical seal components.
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Company information
Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.