This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
The EBM-250HSC is a device designed and developed for the bonding process of wafers and bonding plates (ceramic plates). It can be used before and after the lapping process to achieve high precision in wafer thickness, flatness, warpage, and parallelism.
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basic information
【Device Specifications】 ■ Compatible wafer size: Max. Φ248mm ■ Heating method: Electric heating (Max. 300℃) ■ Cooling method: Chiller (Timer control) ■ Dimensions: W778 x D700 x H1725mm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.