Technical Information "Evaluation of Organic Contamination Using a Wafer Analyzer (B0230)" Released

GC/MS: Gas Chromatography-Mass Spectrometry

The WA (Wafer Analyzer) is a device that heats wafers with a diameter of φ76 to 300mm to elevate their temperature, gasifying organic contaminants adhered to the wafer surface and trapping them in a collection tube. As a result, it can concentrate compounds such as phthalate esters and cyclic siloxanes, which are considered causes of device characteristic impacts and manufacturing troubles, allowing for high-sensitivity measurement using GC/MS. Quantification using hexadecane is also possible. - Evaluation of organic contaminants on one side of the wafer is possible. - Detection of easily volatile components is possible since vacuum pumping is not required. - Organic components can be detected with high sensitivity (for 300mm wafers, on the order of 0.01ng/cm²). - Quantification using hexadecane conversion is possible.

• Contract Analysis

Contec Co., Ltd. has started selling the "SH-9210TSN," an industrial managed switching hub that has obtained CC-Link IE TSN recommended network wiring component certification Class B. It features dual power supply redundancy, a DC power input, eight gigabit ports, and two SFP slots. The SH-9210TSN complies with IEEE 802.3ab (1000BASE-T), IEEE 802.3u (100BASE-TX), and IEEE 802.3 (10BASE-T) standards, and is designed for use in environments where quiet operation and long lifespan are required due to its fanless design. Additionally, it achieves an operating temperature range of -10 to 65°C thanks to its excellent heat dissipation metal casing. It can be installed on a 35mm DIN rail or mounted on walls using various mounting brackets. In addition to a wide-range DC power input (12-48VDC), it supports input from two power supply lines and includes various managed functions for network management, control, and reliability enhancement.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is kept to a minimum. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without any thermal impact on the base material. Repairs can be conducted in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is required, please contact us.