CUI expands its temperature management portfolio with a new line of heat sinks from CUAI Japan.

CUI Japan, Inc. (Headquarters: Tokyo, Representative Director: Katsumi Yamamoto, Abbreviation: CUI Japan) has announced the expansion of its existing portfolio of DC fans and the addition of a heat sink product line. The new aluminum heat sinks in extrusion and press versions are compatible with TO-218, TO-220, TO-252, and TO-263 transistor packages. Designed to improve heat dissipation for low and high power board-level applications, they facilitate the selection of optimal heat sinks for natural convection or forced air cooling systems under four heat resistance conditions.
The extrusion and press heat sinks are available in versions with and without solder pins, either tin-plated or black anodized, and can be used vertically or horizontally. The thermal resistance value measured in a natural convection environment at a ΔT of 75°C is low at 4.49°C/W, and the power loss rating at a ΔT of 75°C in natural convection is up to 16.7W.

Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration
Related Links
Product introduction page