Compatible with TO-218, TO-220, TO-252, and TO-263 transistor packages.
Press extrusion processing to improve heat dissipation in applications Our press extrusion processing heat sink line is an ideal solution for enhancing heat dissipation in low and high power board-level designs. It is compatible with TO-218, TO-220, TO-252, and TO-263 transistor package types and is available in various standard shapes and sizes. Our aluminum heat sinks can be easily measured under four conditions of thermal resistance, making it easy to select the best extrusion or press for natural convection or forced air cooling systems.
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basic information
Aluminum heat sink
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Applications/Examples of results
Improving heat dissipation for low power and high power board-level applications.
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Company information
Same Sky Japan (formerly CUI Japan) is a group company of the American electronic components manufacturer Same Sky (formerly CUI DEVICES) and serves as a sales base for the Japanese market. Our mission is to provide customers with a collaborative design experience, supporting them in achieving their design goals on schedule and within budget. Same Sky Japan offers a wide range of products, including connectors, audio, temperature management, motion control, sensors, and switches. We also handle power products from partner companies such as CUI Inc. Both Same Sky and Same Sky Japan strive to be a trusted and approachable source of electronic components that continuously evolves. We are committed to providing the best support to our customers through our extensive online resources and experienced staff, ensuring that we address various changes and issues that arise during the design phase and contribute to the success of their projects.
![[Case Study] Aluminum Extrusion Heat Sink](https://image.mono.ipros.com/public/product/image/224/2000355542/IPROS32877600373320369243.jpeg?w=280&h=280)
