Special campaign for COM Express/SMARC implementation.

With the COM Express Type 6 Starter Kit Plus, you can quickly design carrier boards and validate software.

The Type 6 Starter Kit Plus consists of a COM Express Type 6 module equipped with an ATX-sized Type 6 reference carrier board. It features a dedicated PCI Express x16 slot for a DDI adapter card that converts DDI signals to DP or HDMI signals, one PCI Express x4 slot for graphics, three PCI Express x1 slots, Serial ATA, VGA, LVDS, USB 3.0/2.0, Gigabit LAN, and Super I/O. All necessary cables are included.

• Embedded Board Computers

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without affecting the base material with heat. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

SPACECOOL Co., Ltd. is pleased to announce that it will exhibit at the "Japan Pavilion" established by the Ministry of the Environment at the 30th Conference of the Parties to the United Nations Framework Convention on Climate Change (COP30), which will be held in Belém, Brazil, from November 10, 2025. "SPACECOOL" is a radiative cooling material that enables zero-energy cooling by dissipating heat into space. At our exhibition booth, we will showcase examples of its use not only in reducing air conditioning energy in buildings but also in heat mitigation measures (adaptation strategies) for tents and parasols. The Japan Pavilion aims to promote excellent technologies, products, and services that support global decarbonization and adaptation to climate change, and to achieve Japan's long-term climate change goal of "net zero by 2050." We believe that our participation plays an important role in this endeavor. Through this exhibition, we aim to accelerate our initiatives with local partners in regions severely affected by heat issues, such as the Middle East, including Saudi Arabia and the United Arab Emirates, as well as Southeast Asia, contributing to global decarbonization and climate change measures.

Castem Co., Ltd. will exhibit at the "Monozukuri World Osaka - Mechanical Components Technology Exhibition" held at Intex Osaka from October 1 (Wednesday) to October 3 (Friday), 2025. We will showcase lost-wax precision casting and MIM (Metal Injection Molding) products, as well as introduce our new technology, mold-less casting "Digital Cast." In addition to our popular casting demonstrations, we will present case studies that solve issues related to metal parts. Please utilize our "Technical Consultation Booth" to learn about optimal manufacturing methods tailored to your needs, from ultra-small lots to mass production. 【Exhibition Overview】 Dates: October 1 (Wednesday) to October 3 (Friday), 2025, 10:00 AM to 5:00 PM Venue: Intex Osaka (1-5-102 Nanko-Kita, Suminoe-ku, Osaka City, Osaka Prefecture) Exhibition Booth Number: Hall 6, B Hall 51-1 Pre-registration allows for smooth entry. It is convenient to register via the URL below before your visit. We sincerely look forward to your attendance. https://www.manufacturing-world.jp/osaka/ja-jp/register.html?code=1431877272389396-VEK