[Technical Information] How to Attach CMP Polishing Pads

Here are the steps and key points for attaching the CMP pad to the platen of the polishing device.
■ Work Procedure
1) Use a solvent such as ethanol and wipes to thoroughly clean the surface of the platen. Dirt on the platen can cause air bubbles.
2) Peel off the liner and gently place the pad on the platen.
3) Supply a small amount of pure water to the pad.
4) Use a circular roller to apply pressure to the center of the pad to adhere it.
5) While rotating the platen at 5 rpm, slowly move the roller towards the outer edge.
6) Once pressure has been applied to about half the radius, stop the platen.
7) Visually check the area where pressure has been applied to ensure there are no air bubbles.
8) After checking for air bubbles, supply pure water to maintain the wet condition of the pad.
9) Rotate the platen at 5 rpm again to continue the adhesion process.
10) After the pressure application is complete, check again for air bubbles. Then, use a brush and HPMJ for conditioning.
*This is a recommended procedure, and other methods can also be used.

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