NITTA DuPont Incorporated Company Overview

We would like to express our congratulations on your continued prosperity. We sincerely appreciate your exceptional support. We would like to inform you that Nitta Haas Co., Ltd. has changed its name as follows, effective April 1, 2020. We will continue to strive to contribute to technological innovation for our customers by providing polishing solutions that realize the "creation of optimal surfaces" required by our customers. We kindly ask for your continued support and guidance. Details: (New Company Name) Nitta DuPont Incorporated (Japanese Company Name) NITTA DuPont Incorporated (English Company Name) Name Change Date: April 1, 2020 There are no changes to the location or contact information. End.

I will explain the basics of CMP (Chemical Mechanical Polishing). ■ Meaning and Definition CMP (Chemical Mechanical Polishing, sometimes referred to as Planarization) refers to a polishing technique that combines mechanical removal through particles such as abrasives and chemical dissolution through a processing solution, resulting in a precision machining technology that achieves extremely flat surfaces. ■ Purpose 1. Planarization - Improvement of reliability, speed, and yield of semiconductor devices - Realization of multilayer wiring and miniaturization by ensuring focus margin in lithography 2. Polishing - Achieving a surface roughness at the nanometer level for wafers and other surfaces - Reduction of surface defects such as scratches and particles - Cost reduction through improved yield As mentioned above, this technology is used in the wiring formation process of semiconductors and in the polishing of silicon wafers and glass substrates, but it is also being explored in new fields such as semiconductor back-end processes (packaging) and electronic components.

CMP slurry may be used after dilution according to the manufacturer's recommendations. Since the recommended conditions and expressions vary depending on the manufacturer and product specifications, it is necessary to start using it only after fully understanding these aspects. ■ Is the dilution by weight ratio or volume ratio? The manufacturer provides recommendations for dilution ratios, but the ratio may change depending on whether it is by weight or by volume, so caution is required. Example) When diluting Slurry A (specific gravity 1.38) with pure water: 1) Weight 3 times dilution: Adjust 10 kg of slurry with 20 kg of pure water. 2) Volume 3 times dilution: Adjust 10 L (=13.8 kg) of slurry with 20 L of pure water. ■ Dilution procedure CMP slurries are designed to maximize their characteristics, and there are products available in packaging forms such as two-component or three-component systems. The manufacturer may recommend dilution procedures for reasons such as ensuring the stability of the slurry. Example) When diluting a two-component slurry (Component A and Component B) with pure water: 1) Dilute Component A with pure water. 2) Add Component B to the mixture from step 1. Since various cases can be considered depending on the manufacturer and product specifications, it is recommended to contact the manufacturer for more details.