We will be exhibiting at the "7th High-Performance Plastic Exhibition" during the High-Performance Materials Week 2018.

Simultaneous punching of polyimide films with adhesive, varying in size and thickness.

Polyimide boasts extremely high heat resistance and excellent mechanical properties, electrical insulation, and chemical resistance. It is used in applications such as insulating substrates for FPC in electronic components used in smartphones and camera modules. Myojo Electric has extensive know-how from years of experience in handling thermosetting resins, allowing us to add a peeling prevention process that is prone to occur during the processing of small-sized films. This enables us to simultaneously process polyimide films of various sizes and thicknesses with thermosetting adhesives applied, and we have a track record of large-volume production projects. Additionally, we can provide a consistent response from material procurement to bonding with supplied parts and after-curing, tailored to customer requests, so please feel free to contact us. 【Product Information】 - Various tape processing - Lamination processing - Thermal lamination - Bonding processing For more details, please contact us or download the catalog.

• Printed Circuit Board
• Processing Contract
• Engineering Plastics

Heat-resistant and insulating glass epoxy, one-stop from molding to processing.

We can contribute to reducing your total costs by molding and machining laminated round bars (pipes) and custom laminated plates made of glass epoxy (Galaepo) according to your specifications, including cutting processes (machining centers, NC lathes), pressing, and routing. We also address various issues such as cutting tools and dust during processing. We have a proven track record in a wide range of fields and applications, from reinforcement plates for electronic components' FPCs to custom products used in heavy electrical, railway, and telecommunications sectors, so please feel free to consult us.

• Processing Contract

Custom-made ultra-thick laminated boards for the power electronics field.

In fields such as power electronics where high voltage power is handled, equipment, plants, railway infrastructure, and communication base stations require insulation materials that conform to the shape of the installation site while maintaining insulation strength. According to customer requests, we can custom-manufacture large-diameter pipes up to 200mm in diameter and pipes with multiple inner diameters using glass substrates and epoxy resin through a wet molding process. Additionally, we can also custom-manufacture ultra-thick laminated boards up to 200mm using paper, cloth, and glass cloth substrates combined with epoxy resin through a pressure heat molding process. Furthermore, for FRP laminated pipes, we use the hand lay-up method (winding method) to freely design the wall thickness. We can provide a consistent response from material supply to machining utilizing our expertise in thermosetting materials. We are also capable of accommodating short lead times and small production runs, so please feel free to contact us.

• Processing Contract

From general-purpose plastics to super engineering plastics, as well as processing of metals in addition to resin materials.

At Meisei Electric Co., Ltd., we leverage our extensive experience in electronic components to not only sell resin materials tailored to our customers' needs but also to provide a wide variety of processing options. Precision cutting can be performed on various resin materials, from general-purpose engineering plastics to super engineering plastics, as well as metals. Additionally, by providing information on material selection and processing methods, we can offer solutions to our customers' problems and cost performance that meets their needs. We also offer a diverse range of molding and bending processing for display-related covers, as well as pressing for tapes and films. Please feel free to consult with us. 【Product Information】 ○ Thermosetting resin processed products ○ Pallet jig processed products ○ Various resin processed products For more details, please contact us or download the catalog.

• Processing Contract

For use in smartphones, automotive, and wearable fields, such as reinforcement plates and for conductive, shielding, and heat dissipation applications.

Information devices such as smartphones, tablet devices, and camera modules are becoming smaller and more high-performance every day. Along with this, there is a demand for high-density mounting of electronic components, as well as measures for heat and high frequency. Meisei Electric provides comprehensive support, from adhesive tape bonding processing to die-cutting of thermosetting tapes with various functions, and from vacuum bonding processing using customer-supplied materials to temporary bonding and complete curing through aging. Additionally, we have a proven track record of large lot mass production, processing different sizes and thicknesses of polyimide in a dedicated clean room, including lamination, separator tab processing, and partial adhesion. Please feel free to contact us. 【Product Information】 - Various tape processing - Lamination processing - Thermal lamination - Bonding processing For more details, please contact us or download the catalog.

• Printed Circuit Board
• Processing Contract
• Engineering Plastics

Bonding processing of optical materials such as OCA with substrates like plastic and glass.

We can provide proposals that include the latest materials, leveraging our trading company functions to connect with material manufacturers for optical films such as anti-reflective and light-diffusing films. We possess equipment with different lamination methods and are equipped to handle mass production by preparing processing jigs based on the know-how we have cultivated over many years, starting from condition setting in principle prototypes. For example, in applications for anti-reflection, we offer proposals tailored to the characteristics of materials such as AG, AR, moth-eye, α-gel, and OCA. We have a track record in fields such as smartphones, tablets, display devices, automotive components, robotics, measurement devices, and wearable technology. 【Business Activities】 ○ Vacuum lamination processing ○ Functional film lamination processing ○ Optical film lamination processing For more details, please contact us or download our catalog.

• Other electronic parts
• Processing Contract
• Engineering Plastics

Yoshikawa Co., Ltd. Realization Division will exhibit at the 40th Nepcon Japan. ■ Dates: January 21 (Wed) - 23 (Fri), 2025 ■ Venue: Tokyo Big Sight ■ Booth: East Hall 4 E6-19 Clean and Static Control Zone The exhibit will feature a storage shelf for slide-type metal masks. 【Efficient storage with a sliding mechanism】 【Easy to take out even while wearing gloves】 【Customization to meet the needs of individual customers】 We invite you to come and see it. ■ Pre-registration (free) is available here or through related links: https://www.nepconjapan.jp/tokyo/ja-jp/register.html?code=1522511758302164-EUA

Fukuda's new flagship model. - Masterless type (FLA-0200 series) - General type (FLA-0201 series) Two models of air leak testers. With the mastering correction function, high-precision measurements can be achieved in a short time. Please take a look at the catalog.

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "240well 2D Code Attached Tube" is a product with a 200μl type and a rack lid lock function. It is compatible with liquid nitrogen vapor. It allows for the storage and management of a large number of samples in a small space, making it easier to understand. Additionally, it does not use sealing materials, which improves sealability and allows for safer use. 【Features】 ■ Developed a 2D code attached tube for ultra-micro volumes (200μl) ■ Compatible with liquid nitrogen vapor ■ Adopts a new type of screw cap that does not use O-rings, packing, or gaskets ■ Improved sealability and safer use due to the absence of sealing materials *For more details, please download the PDF or feel free to contact us.