We will be exhibiting at the "7th High-Performance Plastic Exhibition" during the High-Performance Materials Week 2018.

Simultaneous punching of polyimide films with adhesive, varying in size and thickness.

Polyimide boasts extremely high heat resistance and excellent mechanical properties, electrical insulation, and chemical resistance. It is used in applications such as insulating substrates for FPC in electronic components used in smartphones and camera modules. Myojo Electric has extensive know-how from years of experience in handling thermosetting resins, allowing us to add a peeling prevention process that is prone to occur during the processing of small-sized films. This enables us to simultaneously process polyimide films of various sizes and thicknesses with thermosetting adhesives applied, and we have a track record of large-volume production projects. Additionally, we can provide a consistent response from material procurement to bonding with supplied parts and after-curing, tailored to customer requests, so please feel free to contact us. 【Product Information】 - Various tape processing - Lamination processing - Thermal lamination - Bonding processing For more details, please contact us or download the catalog.

• Printed Circuit Board
• Processing Contract
• Engineering Plastics

Heat-resistant and insulating glass epoxy, one-stop from molding to processing.

We can contribute to reducing your total costs by molding and machining laminated round bars (pipes) and custom laminated plates made of glass epoxy (Galaepo) according to your specifications, including cutting processes (machining centers, NC lathes), pressing, and routing. We also address various issues such as cutting tools and dust during processing. We have a proven track record in a wide range of fields and applications, from reinforcement plates for electronic components' FPCs to custom products used in heavy electrical, railway, and telecommunications sectors, so please feel free to consult us.

• Processing Contract

Custom-made ultra-thick laminated boards for the power electronics field.

In fields such as power electronics where high voltage power is handled, equipment, plants, railway infrastructure, and communication base stations require insulation materials that conform to the shape of the installation site while maintaining insulation strength. According to customer requests, we can custom-manufacture large-diameter pipes up to 200mm in diameter and pipes with multiple inner diameters using glass substrates and epoxy resin through a wet molding process. Additionally, we can also custom-manufacture ultra-thick laminated boards up to 200mm using paper, cloth, and glass cloth substrates combined with epoxy resin through a pressure heat molding process. Furthermore, for FRP laminated pipes, we use the hand lay-up method (winding method) to freely design the wall thickness. We can provide a consistent response from material supply to machining utilizing our expertise in thermosetting materials. We are also capable of accommodating short lead times and small production runs, so please feel free to contact us.

• Processing Contract

From general-purpose plastics to super engineering plastics, as well as processing of metals in addition to resin materials.

At Meisei Electric Co., Ltd., we leverage our extensive experience in electronic components to not only sell resin materials tailored to our customers' needs but also to provide a wide variety of processing options. Precision cutting can be performed on various resin materials, from general-purpose engineering plastics to super engineering plastics, as well as metals. Additionally, by providing information on material selection and processing methods, we can offer solutions to our customers' problems and cost performance that meets their needs. We also offer a diverse range of molding and bending processing for display-related covers, as well as pressing for tapes and films. Please feel free to consult with us. 【Product Information】 ○ Thermosetting resin processed products ○ Pallet jig processed products ○ Various resin processed products For more details, please contact us or download the catalog.

• Processing Contract

For use in smartphones, automotive, and wearable fields, such as reinforcement plates and for conductive, shielding, and heat dissipation applications.

Information devices such as smartphones, tablet devices, and camera modules are becoming smaller and more high-performance every day. Along with this, there is a demand for high-density mounting of electronic components, as well as measures for heat and high frequency. Meisei Electric provides comprehensive support, from adhesive tape bonding processing to die-cutting of thermosetting tapes with various functions, and from vacuum bonding processing using customer-supplied materials to temporary bonding and complete curing through aging. Additionally, we have a proven track record of large lot mass production, processing different sizes and thicknesses of polyimide in a dedicated clean room, including lamination, separator tab processing, and partial adhesion. Please feel free to contact us. 【Product Information】 - Various tape processing - Lamination processing - Thermal lamination - Bonding processing For more details, please contact us or download the catalog.

• Printed Circuit Board
• Processing Contract
• Engineering Plastics

Bonding processing of optical materials such as OCA with substrates like plastic and glass.

We can provide proposals that include the latest materials, leveraging our trading company functions to connect with material manufacturers for optical films such as anti-reflective and light-diffusing films. We possess equipment with different lamination methods and are equipped to handle mass production by preparing processing jigs based on the know-how we have cultivated over many years, starting from condition setting in principle prototypes. For example, in applications for anti-reflection, we offer proposals tailored to the characteristics of materials such as AG, AR, moth-eye, α-gel, and OCA. We have a track record in fields such as smartphones, tablets, display devices, automotive components, robotics, measurement devices, and wearable technology. 【Business Activities】 ○ Vacuum lamination processing ○ Functional film lamination processing ○ Optical film lamination processing For more details, please contact us or download our catalog.

• Other electronic parts
• Processing Contract
• Engineering Plastics

We will be temporarily closed on the following dates due to employee training. We apologize for any inconvenience this may cause and appreciate your understanding. ■ Closure Period June 11 (Thursday) to June 12 (Friday), 2026, all day ■ Regarding Orders 1) Orders placed after June 10 (Wednesday) will generally be shipped on or after June 16 (Tuesday) or June 17 (Wednesday). 2) Orders can be placed anytime on the 【FOSS WEBSHOP】. The official delivery date will be communicated after June 15 (Monday). 3) Please specify your "desired delivery date" when placing an order. 4) In case of emergencies, please contact us not only by sending the order form but also by phone. ■ Regarding Customer Support During the closure, any malfunctions or issues will be accepted via email or voicemail. Please provide detailed information including "model name," "serial number," "symptoms," "contact person's name," and "contact information." Our customer support will contact you in the order of receipt. E-Mail: service@foss.co.jp Contact: 03-5962-4811 Reception Hours: 9:00 AM to 5:00 PM

We will be exhibiting our products at "JECA FAIR 2026 (the 74th Electrical Construction Exhibition)" held at Tokyo Big Sight. At this exhibition, we will be jointly exhibiting with Mibu Electric Manufacturing. Our booth will focus on the "Panel Manufacturing Skill-less Solution," which addresses the labor shortage issues in panel manufacturing that have required skilled workers, enabling less experienced operators to achieve high-quality manufacturing in processes such as wire processing, component assembly, and wiring work. We will also introduce various other products. We invite you to visit our booth during your visit. ■ Exhibition Name: JECA FAIR 2026 (the 74th Electrical Construction Exhibition) ■ Location: Tokyo Big Sight, Halls 1-3 ■ Booth Numbers: 1-01 ECAD Solutions, 1-02 Joint Exhibition with Mibu Electric Manufacturing ■ Dates: May 27 (Wednesday) - May 29 (Friday), 2026, for three days ■ Hours: May 27 (Wednesday) 10:30 AM - 5:00 PM May 28 (Thursday) 10:00 AM - 5:00 PM May 29 (Friday) 10:00 AM - 4:30 PM *For more information about the exhibited products, please download the materials. Feel free to contact us with any inquiries.

We would like to express our gratitude for your continued support and announce a campaign where you can purchase consumables at a great price. We will offer various consumables that need to be replaced regularly for high-precision and stable analysis, as well as safe decomposition work, at a special price of 20% off. For more details, please refer to each leaflet.

The "HM-S6" is an embedded park sensor that detects vehicles through changes in magnetic flux and can respond to various situations from passing to stationary. It can be used for the opening and closing of the input doors at waste treatment plants, as well as for gates where vehicles pass and in outdoor parking applications. It can also be installed on rebar and steel plates. 【Features】 - Resistant to the effects of natural environments such as rain, snow, temperature changes, and geomagnetism. - Protection rating IP68 reduces the risk of water ingress. - Ten times the load capacity compared to conventional embedded park sensors (according to our comparison). - Can distinguish between vehicles even when they pass continuously, one by one. - Can be installed on rebar and steel plates. *For more details, please refer to the PDF document or feel free to contact us.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for metal crack repair without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material with heat. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.