[Technical Information] Components of CMP Slurry 2

This time, I will explain about abrasives, one of the materials used in CMP slurries.
■ Types of Slurry Abrasives
Currently, the materials used as abrasives for slurries include the following:
1) Silica (SiO2)
2) Ceria (CeO2)
3) Alumina (Al2O3)
Most of the abrasives mentioned above are inorganic, but at the research level, composite abrasives of inorganic and organic materials are also being developed.
■ Overview and Characteristics of Abrasives
1) Silica Abrasives
- Colloidal Silica: Synthesized by precipitation methods or sol-gel methods. The shapes can be spherical or irregular.
- Fumed Silica: Synthesized through gas-phase reactions in flames. The processing efficiency is often higher than that of colloidal silica.
2) Ceria Abrasives
- The abrasives themselves have chemical activity, which generally results in higher processing efficiency for SiO2.
- They have high sedimentation properties and low washability.
3) Alumina Abrasives
- They have a strong mechanical polishing effect. Due to their larger particle size and Mohs hardness, they exhibit high processing efficiency.
- They have even higher sedimentation properties but are inferior in defect performance, such as scratching.
The selection of abrasives is a very key factor in slurry design. We select abrasives based on the intended applications and targets of our customers.

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Introduction page for Nitta Haas products, including CMP slurry