【Basic Knowledge】What is CMP (Chemical Mechanical Polishing)?

I will explain the basics of CMP (Chemical Mechanical Polishing).
■ Meaning and Definition
CMP (Chemical Mechanical Polishing, sometimes referred to as Planarization) refers to a polishing technique that combines mechanical removal through particles such as abrasives and chemical dissolution through a processing solution, resulting in a precision machining technology that achieves extremely flat surfaces.
■ Purpose
1. Planarization
- Improvement of reliability, speed, and yield of semiconductor devices
- Realization of multilayer wiring and miniaturization by ensuring focus margin in lithography
2. Polishing
- Achieving a surface roughness at the nanometer level for wafers and other surfaces
- Reduction of surface defects such as scratches and particles
- Cost reduction through improved yield
As mentioned above, this technology is used in the wiring formation process of semiconductors and in the polishing of silicon wafers and glass substrates, but it is also being explored in new fields such as semiconductor back-end processes (packaging) and electronic components.

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On Nitta Haas's corporate site, we explain what polishing and CMP are and in what fields they are used.