Vecow will exhibit at "Automation 2019" in Saint Petersburg, Russia.

5.25-inch SBC board "EXBC-1000 Series" equipped with Xeon/Core compatible C246/H310 chipsets.

We will release the "EXBC-1000 series," an embedded 5.25-inch SBC board that supports the 8th generation processors with high development flexibility. Equipped with the latest Intel chipset, it supports the 8th generation Intel Xeon/Core processors, achieving high performance and high expandability compared to previous products. Additionally, by combining it with ECC (Error-Correcting Code) memory, it is possible to enhance system reliability. Furthermore, with the inclusion of USB 3.1 and PCIe (Gen3) slots, it allows for the connection of high-speed I/O devices, enabling high-speed data processing. - EXBC-1100E C246 chipset/SUMIT compatible 1 PCIe (x16, x4, x1) - EXBC-1100 C246 chipset 1 PCIe (x16, x4, x1) - EXBC-1000 H310 chipset 1 PCIe x16 *For main specifications, please download the catalog or feel free to contact us.

• Expansion Boards
• Embedded Board Computers
• Embedded system design service

Vecow's first MicroATX motherboard UMBC-1000 series equipped with Xeon/Core compatible C246/H310 chipsets.

We will release the MicroATX motherboard "UMBC-1000 series," which supports the 8th generation processors with high development flexibility. Equipped with Intel's latest chipset, it is compatible with the 8th generation Intel Xeon/Core processors. The "UMBC-1100," featuring the Intel C246, supports workstation-class Intel Xeon processors and achieves high performance and expandability compared to previous products. Additionally, by combining it with ECC (Error-Correcting Code) memory, it is possible to enhance system reliability. Furthermore, with the inclusion of M.2, USB 3.1, and PCI Express (Gen3) slots, it allows for the connection of high-speed I/O devices, enabling fast data processing. - UMBC-1100: C246 chipset - UMBC-1000: H310 chipset *For detailed specifications, please download the catalog or feel free to contact us.

• Industrial PCs
• Expansion Boards
• Embedded Board Computers

Emphasizing computational performance! Industrial PC equipped with the latest workstation-class 8th generation CPU and RTX.

The "ECX-1400/1300 PEG Series" is a box PC that offers excellent high performance for machine vision, factory automation, robot control, Industry 4.0, deep learning, VR (virtual reality) and AR (augmented reality), automotive information systems, various machinery, and industrial IoT (IIoT) markets. - RTX 2070 - RTX 2060 The above graphics cards can be installed as options; please inquire about other specifications. *Main specifications can be confirmed by downloading the catalog or visiting our website.

• Image Processing Equipment
• Industrial PCs
• Embedded system design service

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without affecting the base material with heat. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

SPACECOOL Co., Ltd. is pleased to announce that it will exhibit at the "Japan Pavilion" established by the Ministry of the Environment at the 30th Conference of the Parties to the United Nations Framework Convention on Climate Change (COP30), which will be held in Belém, Brazil, from November 10, 2025. "SPACECOOL" is a radiative cooling material that enables zero-energy cooling by dissipating heat into space. At our exhibition booth, we will showcase examples of its use not only in reducing air conditioning energy in buildings but also in heat mitigation measures (adaptation strategies) for tents and parasols. The Japan Pavilion aims to promote excellent technologies, products, and services that support global decarbonization and adaptation to climate change, and to achieve Japan's long-term climate change goal of "net zero by 2050." We believe that our participation plays an important role in this endeavor. Through this exhibition, we aim to accelerate our initiatives with local partners in regions severely affected by heat issues, such as the Middle East, including Saudi Arabia and the United Arab Emirates, as well as Southeast Asia, contributing to global decarbonization and climate change measures.

Castem Co., Ltd. will exhibit at the "Monozukuri World Osaka - Mechanical Components Technology Exhibition" held at Intex Osaka from October 1 (Wednesday) to October 3 (Friday), 2025. We will showcase lost-wax precision casting and MIM (Metal Injection Molding) products, as well as introduce our new technology, mold-less casting "Digital Cast." In addition to our popular casting demonstrations, we will present case studies that solve issues related to metal parts. Please utilize our "Technical Consultation Booth" to learn about optimal manufacturing methods tailored to your needs, from ultra-small lots to mass production. 【Exhibition Overview】 Dates: October 1 (Wednesday) to October 3 (Friday), 2025, 10:00 AM to 5:00 PM Venue: Intex Osaka (1-5-102 Nanko-Kita, Suminoe-ku, Osaka City, Osaka Prefecture) Exhibition Booth Number: Hall 6, B Hall 51-1 Pre-registration allows for smooth entry. It is convenient to register via the URL below before your visit. We sincerely look forward to your attendance. https://www.manufacturing-world.jp/osaka/ja-jp/register.html?code=1431877272389396-VEK