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  1. Home
  2. Industrial Electrical Equipment
  3. ADLINKジャパン 東京本社
  4. The newly released SMARC module specification revision 2.1 will be the first open AIoM (AI on Module) specification.
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  • Apr 15, 2020
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Apr 15, 2020

The newly released SMARC module specification revision 2.1 will be the first open AIoM (AI on Module) specification.

ADLINKジャパン ADLINKジャパン 東京本社
ADLINK Technology, one of the main contributors to the SMARC SGET committee, has announced the release of the SMARC module revision 2.1. The SGET (Standardization Group for Embedded Technologies) has just introduced the latest future-proof specification 2.1. The new features are only additional items that do not affect the multiplexing of existing signals and the pins of the edge connector assigned in the 2.0 specification, making the specification fully backward compatible with the current specification 2.0. The main additions are as follows: - Anticipating the needs of the AI and robotics markets, support for up to four MIPI CSI ports - Expansion of Ethernet ports through multiplexing of SERDES signals on the third and fourth PCIe x1 interfaces - Various minor additions for initially unused pins such as plus 2 GPIO pins and PCIe clock request signals
SMARC 2.1
SMARC 2.1
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ADLINK_PR_SMARC_2.1_Specification_ADJ0415.pdf[1136658]

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ADLINK News Release
The newly released SMARC module specification revision 2.1 is the first open AIoM (AI on Module) specification.

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LEC-AL_ProductImage_en_20171201_v2.png

CPU module "SMARC" [LEC-AL]

SMARC short-size module equipped with Intel Atom, Pentium, and Celeron processors.

SMARC is a definition for a diverse and compact-sized computer module targeting applications that require low power, low cost, and high performance. This module typically uses an ARM architecture SOC similar to those found in tablet computers and smartphones. Low-power SOCs and CPUs, such as X86 devices for tablets and other RISC CPUs, can also be utilized. The maximum power of the module is usually below 6W. The module is used as part of portable or stationary embedded systems. Additionally, core CPUs and associated boards, such as DRAM, boot flash, power sequencing, CPU power, GBE, and single-channel LVDS display transmitters, are connected to the module. The module is used with application-specific carrier boards, which include components like audio codecs, touch controllers, and wireless devices. By using a modular approach, it offers excellent expansion and upgrade capabilities, reduces time to market, and achieves low cost, low power, and small size.

  • Embedded Board Computers

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LEC-iMX6_image.jpg

CPU module "SMARC" [LEC-iMX6]

NXP/i.MX6 equipped SMARC short-size module

The SMARC ("Smart Mobility ARChitecture") is a definition for a versatile small form factor computer-on-module targeting applications that require low power, cost-effectiveness, and high performance. It also caters to systems that need more compact solutions than PC-oriented form factors. ARM SoCs eliminate the need for chips designed for PC platforms and consume less power, significantly reducing the amount of board space required for power conversion devices and power lines. This enables the use of smaller form factors and promotes the adoption of SMARC-compliant modules in low-power mobile devices. The actual power consumption of SMARC CPU modules typically ranges from 2W to 6W, allowing for passive cooling and reducing the effort and overall costs for subsequent development. By using this standard, up to 9W of continuous power can be utilized for more demanding applications.

  • Embedded Board Computers

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LEC-AL

LEC-AL

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NXP/i.MX6 equipped SMARC short-size module [LEC-iMX6]

NXP/i.MX6 equipped SMARC short-size module [LEC-iMX6]

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SMARC (Smart Mobility Architecture for Resilient Cities)

SMARC (Smart Mobility Architecture for Resilient Cities)

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SMARC 2.0

SMARC 2.0

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ADLINKジャパン
Industrial Electrical Equipment
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[Free Materials Available] Introducing Useful Information on Vehicle Detection Sensors!

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To customers considering the introduction of vehicle detection sensors for parking lot construction, design, and management: Are you facing any issues with the challenges you currently have or selecting the right sensors for parking lot management? Hotron offers free materials that explain how to utilize vehicle detection sensors and the benefits of their introduction! ▽ Here is the lineup of materials ◉ Basic Guide to Vehicle Detection Sensors This guide focuses on the challenges and solutions in parking lot operations, introducing the overview of vehicle detection sensors. ◉ Key Points for Introducing Vehicle Detection Sensors This material discusses the benefits of introduction based on installation locations and specific challenges. ◉ Case Studies of Vehicle Detection Sensor Implementation This document introduces the challenges before implementation and the results after introduction. For more details, please download from our website and check it out. https://www.hotron.co.jp/download/

Oct 21, 2025

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Digital Agency: "paperlogic can be used as contract documents for the national and local governments."

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"Electronic contracts for national and local governments are also available with 'paperlogic Electronic Contracts'" In December of last year (2023), we inquired about our service 'paperlogic Electronic Contracts' regarding the 'Law and Orders Related to Regulations on New Business Activities' utilizing the Digital Agency's gray zone resolution system. As a result, we received a response from the Digital Agency stating that 'paperlogic Electronic Contracts' can be used as an electronic record in place of paper contracts for national and local government contracts. "'paperlogic' is endorsed by the Digital Agency" In this inquiry, we received confirmation that 'paperlogic Electronic Contracts' can be utilized as an electronic record in place of paper contracts for national and local government contracts. From now on, you can confidently use 'paperlogic Electronic Contracts' not only for contracts between private companies but also for all types of contracts in local government practices, including administrative contracts and discretionary contracts. For business document digital transformation and electronic contract services, feel free to consult with paperlogic.

Oct 21, 2025

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PFAS Regulation Countermeasures! ■■ Leak Test Equipment for Small Electronic Components|MSA-0101 series ■■ Does not use fluorinated inert fluids. PFAS-free. Offers accuracy equal to or better than liquid immersion testing.

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● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

Oct 21, 2025

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Casting prototype and casting repair.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without affecting the base material with heat. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Oct 21, 2025

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"Welding repair crack repair" We will repair metal cracks without applying heat.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

Oct 20, 2025

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